Browsing by Author Made, Riko I.

Showing results 1 to 11 of 11
Issue DateTitleAuthor(s)
 2012Effect of copper TSV annealing on via protrusion for TSV wafer fabricationHeryanto, A.; Putra, W. N.; Trigg, Alastair David; Gao, S.; Kwon, W. S.; Che, Faxing; Ang, X. F.; Wei, J.; Made, Riko I.; Gan, Chee Lip; Pey, Kin Leong
2013Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuitsMade, Riko I.; Peng, Lan; Li, Hong Yu; Gan, Chee Lip; Tan, Chuan Seng
2009Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnectsMade, Riko I.; Thompson, Carl V.; Leong, H. L.; Li, H. Y.; Gan, Chee Lip; Pey, Kin Leong
 2011Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuitsYan, Li Ling; Gan, Chee Lip; Kor, Katherine Hwee Boon; Chia, Hong Ling; Pey, Kin Leong; Made, Riko I.; Thompson, Carl V.
2012Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuitsMade, Riko I.; Thompson, Carl V.; Gan, Chee Lip; Yan, Li Ling; Kor, Katherine Hwee Boon; Chia, Hong Ling; Pey, Kin Leong
2013Improved mechanical and thermomechanical properties of alumina substrate via iron dopingMade, Riko I.; Phua, Eric Jian Rong; Pramana, Stevin Snellius; Wong, Chee Cheong; Chen, Zhong; Gan, Chee Lip; Tok, Alfred Iing Yoong
2017The integration of InGaP LEDs with CMOS on 200 mm silicon wafersWang, Bing; Lee, Kwang Hong; Wang, Cong; Wang, Yue; Made, Riko I.; Sasangka, Wardhana Aji; Nguyen, Viet Cuong; Lee, Kenneth Eng Kian; Tan, Chuan Seng; Yoon, Soon Fatt; Fitzgerald, Eugene A.; Michel, Jurgen
2010Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interfaceMade, Riko I.; Gan, Chee Lip; Tan, Chuan Seng
 2009Study of low-temperature thermocompression bonding in Ag-In solder for packaging applicationsLau, John H.; Made, Riko I.; Gan, Chee Lip; Yan, Li Ling; Yu, Aibin; Yoon, Seung Wook; Lee, Chengkuo
2012Study of metal additives to alumina ceramics substrate for high temperature and pressure applicationMade, Riko I.; Phua, Eric Jian Rong; Sharif, Ahmed; Pramana, Stevin Snellius; Wong, Chee Cheong; Chen, Zhong; Nachiappan, Vivek Chidambaram; Ho, Beng Yeung; Gao, Shan; Tok, Alfred Iing Yoong
2011Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuitsMade, Riko I.; Lan, Peng; Li, Hong Yu; Gan, Chee Lip; Tan, Chuan Seng