Browsing by Author Made, Riko I.
Showing results 1 to 12 of 12
| Issue Date | Title | Author(s) | |
|---|---|---|---|
| 2012 | Effect of copper TSV annealing on via protrusion for TSV wafer fabrication | Heryanto, A.; Putra, W. N.; Trigg, Alastair David; Gao, S.; Kwon, W. S.; Che, Faxing; Ang, X. F.; Wei, J.; Made, Riko I.; Gan, Chee Lip; Pey, Kin Leong | |
 | 2013 | Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits | Made, Riko I.; Peng, Lan; Li, Hong Yu; Gan, Chee Lip; Tan, Chuan Seng |
| 2009 | Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects | Made, Riko I.; Thompson, Carl V.; Leong, H. L.; Li, H. Y.; Gan, Chee Lip; Pey, Kin Leong |
| 2012 | Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits | Made, Riko I.; Thompson, Carl V.; Gan, Chee Lip; Yan, Li Ling; Kor, Katherine Hwee Boon; Chia, Hong Ling; Pey, Kin Leong |
| 2011 | Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits | Yan, Li Ling; Gan, Chee Lip; Kor, Katherine Hwee Boon; Chia, Hong Ling; Pey, Kin Leong; Made, Riko I.; Thompson, Carl V. | |
| 2013 | Improved mechanical and thermomechanical properties of alumina substrate via iron doping | Made, Riko I.; Phua, Eric Jian Rong; Pramana, Stevin Snellius; Wong, Chee Cheong; Chen, Zhong; Gan, Chee Lip; Tok, Alfred Iing Yoong |
| 2017 | The integration of InGaP LEDs with CMOS on 200 mm silicon wafers | Wang, Bing; Lee, Kwang Hong; Wang, Cong; Wang, Yue; Made, Riko I.; Sasangka, Wardhana Aji; Nguyen, Viet Cuong; Lee, Kenneth Eng Kian; Tan, Chuan Seng; Yoon, Soon Fatt; Fitzgerald, Eugene A.; Michel, Jurgen |
| 2010 | Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface | Made, Riko I.; Gan, Chee Lip; Tan, Chuan Seng |
| 2022 | Noble metal alloy thin films by atomic layer deposition and rapid Joule heating | Guo, Yuanyuan; Zou, Yiming; Cheng, Chunyu; Wang, Leyan; Made, Riko I.; Goei, Ronn; Tan, Kwan Wee; Li, Shuzhou; Tok, Alfred Iing Yoong |
| 2009 | Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications | Lau, John H.; Made, Riko I.; Gan, Chee Lip; Yan, Li Ling; Yu, Aibin; Yoon, Seung Wook; Lee, Chengkuo | |
| 2012 | Study of metal additives to alumina ceramics substrate for high temperature and pressure application | Made, Riko I.; Phua, Eric Jian Rong; Sharif, Ahmed; Pramana, Stevin Snellius; Wong, Chee Cheong; Chen, Zhong; Nachiappan, Vivek Chidambaram; Ho, Beng Yeung; Gao, Shan; Tok, Alfred Iing Yoong |
| 2011 | Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits | Made, Riko I.; Lan, Peng; Li, Hong Yu; Gan, Chee Lip; Tan, Chuan Seng |