Browsing by Author Nai, S. M. L.

Showing results 1 to 5 of 5
Issue DateTitleAuthor(s)
 2012Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubesNai, S. M. L.; Xu, L. Y.; Wei, J.; Han, Yongdian; Jing, Hongyang; Tan, Cher Ming
2009Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growthNai, S. M. L.; Xu, L. Y.; Han, Yongdian; Jing, Hongyang; Tan, Cher Ming; Wei, Jun
 2012Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder jointsNai, S. M. L.; Xu, L. Y.; Wei, J.; Jing, Hongyang; Tan, Cher Ming; Han, Yongdian
 2012Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cyclingNai, S. M. L.; Xu, L. Y.; Wei, J.; Han, Yongdian; Jing, Hongyang; Tan, Cher Ming
2008A new creep model for SnAgCu lead-free composite solders : incorporating back stressNai, S. M. L.; Xu, L. Y.; Zhang, S. R.; Han, Yongdian; Jing, Hongyang; Tan, Cher Ming; Wei, Jun