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| Issue Date | Title | Author(s) |
| | 2018 | Characterisation of porosity, density, and microstructure of directed energy deposited stainless steel AISI 316L | Tan, Eddie Zhi’En; Pang, John Hock Lye; Kaminski, Jacek; Pepin, Helene |
 | 2000 | Characterisation of the temperature and time dependent mechanical properties and solder | Tan, Kwang Hong. |
| | 2012 | Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints | Che, Faxing; Pang, John Hock Lye |
| | 2013 | Clothing polymer fibers with well-aligned and high-aspect ratio carbon nanotubes | Sun, Gengzhi; Zheng, Lianxi; An, Jia; Pan, Yongzheng; Zhou, Jinyuan; Zhan, Zhaoyao; Pang, John Hock Lye; Chua, Chee Kai; Leong, Kah Fai; Li, Lin |
 | 2017 | Crack monitoring using multiple smart materials; fiber-optic sensors & piezo sensors | Maheshwari, Muneesh; Annamdas, Venu Gopal Madhav; Pang, John Hock Lye; Asundi, Anand; Tjin, Swee Chuan |
| 2015 | Damage monitoring using fiber optic sensors and by analysing electro-mechanical admittance signatures obtained from piezo sensor | Maheshwari, Muneesh; Annamdas, Venu Gopal Madhav; Pang, John Hock Lye; Tjin, Swee Chuan; Asundi, Anand Krishna |
| 2004 | Design-for-reliability methodology for evaluation of lead-free solder performance in electronic packaging assemblies | Pang, John Hock Lye |
| 2005 | Design-for-reliability methodology for lead-free solder joints | Low, Tse Hoong |
| 1991 | Determination of Kic of metals | Ang, Hock Eng; Loh, Nee Lam; Seet, Gerald Gim Lee; Pang, John Hock Lye |
| 2004 | Development of a failure assessment methodology for flip chip electronic assembly | Yeo, Alfred Swain Hong. |
| | 2011 | Electrochemical capacitive properties of CNT fibers spun from vertically aligned CNT arrays | Sun, Gengzhi; Zhou, Jinyuan; Yu, Feng; Zhang, Yani; Pang, John Hock Lye; Zheng, Lianxi |
| 2018 | Failure Assessment Diagram (FAD) analysis of fatigue test results for X65 welded joints | Hoh, Hsin Jen; Pang, John Hock Lye; Tsang, Kin Shun |
| 1997 | Fatigue cumulative damage and crack propagation analysis of welded joints | Shi, Zhao Feng. |
| 2015 | Fibre optic sensors for load-displacement measurements and comparisons to piezo sensor based electromechanical admittance signatures | Pang, John Hock Lye; Tjin, Swee Chuan; Asundi, Anand Krishna; Maheshwari, Muneesh; Annamdas, Venu Gopal Madhav |
| 2001 | Finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading | Chong, Yok Rue. |
| | 2020 | Finite element and experimental study on multiaxial fatigue analysis of rail clip failures | Liu, Zhufeng; Tsang, Kin Shun; Liu, Yang; Pang, John Hock Lye |
| 1995 | Finite element study of adhesive bonded specimen with cracks | Lui, Wai Meng. |
| | 2012 | Fracture of Sn-Ag-Cu solder joints on Cu substrates : I. effects of loading and processing conditions | Pang, John Hock Lye; Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R. |
| | 2014 | Highly reliable carbon nanotube-based composite fibers cross-linked by a 3D polymer network | Sun, Gengzhi; Zheng, Lianxi; Zhan, Zhaoyao; Jiang, Chunbo; Hansen, Reinack V.; Khor, Yengpeng; Pang, John Hock Lye |
| 1998 | Impact testing and analysis of adhesive bonds | Cheng, Soon Kiong. |
