Browsing by Author Peng, L.

Showing results 1 to 6 of 6
Issue DateTitleAuthor(s)
 2013Cu–Cu hermetic seal enhancement using self-assembled monolayer passivationPeng, L.; Leong, K. C.; Lim, Dau Fatt; Fan, Ji; Tan, Chuan Seng
 2012Effect of prebonding anneal on the microstructure evolution and Cu–Cu diffusion bonding quality for three-dimensional integrationPeng, L.; Zhang, L.; Li, H.Y.; Lim, Dau Fatt; Tan, Chuan Seng
 2012Operating TSV in stable accumulation capacitance region by utilizing Al2O3-induced negative fixed chargeZhang, L.; Li, H. Y.; Peng, L.; Lo, Guo-Qing; Kwong, Dim Lee; Tan, Chuan Seng
 2012Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less Cu-Cu bonding for 3D wafer stackingPeng, L.; Li, H. Y.; Fan, Ji; Gao, Shan; Tan, Chuan Seng
 2012Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stackingPeng, L.; Zhang, L.; Li, H. Y.; Fan, Ji; Lim, Dau Fatt; Tan, Chuan Seng
 2012Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliabilityPeng, L.; Fan, Ji; Li, Kwok Hung; Tan, Chuan Seng