Browsing by Author Peng, Lan

Showing results 1 to 4 of 4
Issue DateTitleAuthor(s)
2013Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuitsMade, Riko I.; Peng, Lan; Li, Hong Yu; Gan, Chee Lip; Tan, Chuan Seng
 2012Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realizationTan, Chuan Seng; Lim, Dau Fatt; Peng, Lan; Li, Hong Yu
 2012Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bondsTan, Chuan Seng; Peng, Lan; Fan, Ji; Li, Hong Yu; Gao, Shan
2012Wafer-level fine pitch Cu-Cu bonding for 3-D stacking of integrated circuitsPeng, Lan