Browsing by Author Qi, Guojun

Showing results 1 to 8 of 8
Issue DateTitleAuthor(s)
 2006Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder jointsQi, Guojun; Chen, Z.; He, M.; Kumar, A.
2004Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallizationHe, Min; Chen, Zhong; Qi, Guojun; Wong, Chee C.; Mhaisalkar, Subodh Gautam
2007Electret mechanism, hysteresis, and ambient performance of sol-gel silica gate dielectrics in pentacene field-effect transistorsCahyadi, Tommy; Tan, H. S.; Mhaisalkar, Subodh Gautam; Lee, Pooi See; Boey, Freddy Yin Chiang; Chen, Z. K.; Ng, C. M.; Rao, V. R.; Qi, Guojun
2004Interfacial reaction between Sn-rich solders and Ni-based metallizationKumar, A.; Yeo, P. T.; He, Min; Qi, Guojun; Chen, Zhong
2004Intermetallic compound formation between Sn–3.5Ag solder and Ni-based metallization during liquid state reactionHe, Min; Lau, Wee Hua; Qi, Guojun; Chen, Zhong
2005Mechanical strength of thermally aged Sn-3.5Ag/Ni-P solder jointsHe, Min; Chen, Zhong; Qi, Guojun
 2004Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallizationChen, Zhong; He, Min; Qi, Guojun
2004Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallizationHe, Min; Chen, Zhong; Qi, Guojun