Showing results 1 to 20 of 64
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| Issue Date | Title | Author(s) |
 | 2009 | 3D circuit model for 3D IC reliability study | Tan, Cher Ming; He, Feifei |
| 2012 | 3D simulation-based research on the effect of interconnect structures on circuit reliability | He, Feifei; Tan, Cher Ming |
| | 2014 | Ab initio simulation of electronic and mechanical properties of aluminium for fatigue early feature investigation | Zhang, Shuai; Tan, Cher Ming; Cheng, Shuguang; Deng, Tianqi; He, Feifei; Su, Haibin |
 | 2002 | Application of low frequency noise in the study of VLSI electromigration | Lim, Shin Yeh. |
| 2002 | Application of Wigner–Ville distribution in electromigration noise analysis | Tan, Cher Ming; Lim, Shin Yeh |
| | 2011 | Applications of finite element methods for reliability study of ULSI interconnections | Tan, Cher Ming; Li, Wei; Gan, Zhenghao |
| 2012 | Applications of multi-walled carbon nanotube in electronic packaging | Tan, Cher Ming; Baudot, Jacques Desire Charles; Han, Yongdian; Jing, Hongyang |
| 2010 | Characterization of failure in integrated circuit due to electrostatic discharge (ESD) | Goh, Jia Jun. |
| 2002 | Characterization techniques for power semiconductor and magnetic drives | Tseng, King Jet; Foo, Chek Fok; Tan, Cher Ming |
| 2009 | Comparative study of non-standard power diodes | Tan, Cher Ming; Raghavan, Nagarajan; Sun, Lina; Hsu, Chuck; Wang, Chase |
| | 2011 | Comparison of electromigration simulation in test structure and actual circuit | He, Feifei; Tan, Cher Ming |
| 2006 | Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding | Tan, Cher Ming; Yu, Weibo; Wei, Jun |
| | 2009 | Comparison of stress-induced voiding phenomena in copper line–via structures with different dielectric materials | Hou, Yuejin; Tan, Cher Ming |
| | 2012 | Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes | Nai, S. M. L.; Xu, L. Y.; Wei, J.; Han, Yongdian; Jing, Hongyang; Tan, Cher Ming |
| 2005 | Current crowding effect on copper dual damascene via bottom failure for ULSI applications | Vairagar, A. V.; Tan, Cher Ming; Arijit, Roy; Krishnamoorthy, Ahila; Mhaisalkar, Subodh Gautam |
| | 2014 | Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter | Tan, Cher Ming; Yu, Wen Zhi |
| | 2012 | Degradation behavior of high power light emitting diode under high frequency switching | Chen, S. H.; Tan, G. H.; Tan, Cher Ming; He, Feifei |
| 2014 | Degradation model of a linear-mode LED driver and its application in lifetime prediction | Lan, Song; Tan, Cher Ming |
| 2003 | Design and fabrication of insulated gate bipolar transistor (IGBT) using wafer bonding technology | Tan, Cher Ming.; Tse, Man Siu. |
| 2002 | Design of insulated gate bipolar transistor using novel structure | Zhang, Guowei |
