Browsing by Author Toh, Kok Chuan

Showing results 1 to 12 of 12
Issue DateTitleAuthor(s)
2001Analysis of heat dissipation and thermal enhancements in electronic packagesLoh, Chiah Vern.
1998Analysis of temperature profile on a PCB in the preheat section of a wave soldering processHoe, Swee Long.
 2020Convective filmwise condensation on the outer surface of a vertical tube : a theoretical analysisLiu, Pengfei; Ho, Jin Yao; Wong, Teck Neng; Toh, Kok Chuan
1995Development of a technique for thermal visualisation of heat transfer from fins using laser holographic interferometryLeong, Kai Choong; Liu, Chang Yu; Tam, Siu Chung; Toh, Kok Chuan; Tso, Chih Ping
2002Development of compact thermal models for advanced electronic packagesXie, Ming.
2004Direct liquid cooling of stacked multichip modulesChen, Xuyang.
2000Experimental and numerical evaluation of heat sink performanceViswanathan Chinniah
2005Fluid flow and heat transfer characteristics in microchannelsAng, Gabriel Pau Hwee; Toh, Kok Chuan; Ooi, Kim Tiow; Wong, Teck Neng
2000Heat dissipation in ball grid array packagesYing, Teck Mun.
1999Investigation of the performance of a thermosyphon pin fin heat sinkSun, Jianchun.
 2020Laminar film condensation inside and outside vertical diverging/converging small channels : a theoretical studyLiu, Pengfei; Ho, Jin Yao; Wong, Teck Neng; Toh, Kok Chuan
2008A procedure for the motion of particle-encapsulated droplets in microchannelsYap, Yit Fatt; Chai, J. C.; Wong, Teck Neng; Nguyen, Nam-Trung; Toh, Kok Chuan; Zhang, H. Y.; Yobas, Levent