Browsing by Author Wong, Chee C.

Showing results 1 to 8 of 8
Issue DateTitleAuthor(s)
2007Critical temperatures in thermocompression gold stud bondingZhang, G. G.; Ang, X. F.; Chen, Z.; Wong, Chee C.; Wei, J.
2006The effect of aspect ratio scaling on hydrostatic stress in passivated interconnectsAng, Derrick; Wong, Chee C.; Ramanujan, Raju V.
2008Effect of chain length on low temperature gold-gold bonding by self assembled monolayersAng, X. F.; Chen, Z.; Wong, Chee C.; Wei, J.
 2008Effect of electromigration on the mechanical performance of Sn-3.5Ag solder joints with Ni and Ni-P metallizationsKumar, Aditya; Yang, Ying; Wong, Chee C.; Kripesh, Vaidhyanathan; Chen, Zhong
2003Effect of plating parameters on the intrinsic stress in electroless nickel platingChen, Zhong; Xu, Xiaoda; Wong, Chee C.; Mhaisalkar, Subodh Gautam
2004Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallizationHe, Min; Chen, Zhong; Qi, Guojun; Wong, Chee C.; Mhaisalkar, Subodh Gautam
 2008Pulse electroplating of copper film : a study of process and microstructureZhang, X.; Tu, K. N.; Chen, Z.; Tan, Y. K.; Wong, Chee C.; Mhaisalkar, Subodh Gautam; Li, X. M.; Tung, Chih Hang; Cheng, C. K.
2007Self-assembled monolayers for reduced temperature direct metal thermocompression bondingAng, X. F.; Li, F. Y.; Tan, W. L.; Chen, Z.; Wong, Chee C.; Wei, J.