Browsing by Author Xu, Cheng

Showing results 1 to 6 of 6
Issue DateTitleAuthor(s)
2018Advanced flip chip and wafer level packages for 2.5D and 3D IC package technologyXu, Cheng
2018An anonymous handover authentication scheme based on LTE-A for vehicular networksXu, Cheng; Huang, Xiaohong; Ma, Maode; Bao, Hong
 2019Evaluation of fan-out wafer level package strengthXu, Cheng; Zhong, Zhao-Wei; Choi, Won-kyoung
2017A privacy-preserving and cross-domain group authentication scheme for vehicular in LTE-A networksXu, Cheng; Huang, Xiaohong; Ma, Maode; Bao, Hong
2018A secure and efficient message authentication scheme for vehicular networks based on LTE-VXu, Cheng; Huang, Xiaohong; Ma, Maode; Bao, Hong
2018Thermal test effect on fan-out wafer level package strengthXu, Cheng; Zhong, Zhao Wei; Choi, W. K.