| Issue Date | Title | Author(s) |
| | 2012 | A 24-GHz microstrip grid array antenna | Lu, Y. L.; Zhang, Y. P.; Zhang, Lin |
 | 1996 | Development of an expert CAD package for plastic injection moulds (Undercut Mould Design) | Zhang, Lin |
 | 2020 | The effects of strain and composition on the conduction-band offset of direct band gap type-I GeSn/GeSnSi quantum dots for CMOS compatible mid-IR light source | Chen, Qimiao; Zhang, Lin; Zhou, Hao; Li, Wei; Son, Bong Kwon; Tan, Chuan Seng |
 | 2016 | Germanium-on-silicon nitride waveguides for mid-infrared integrated photonics | Li, Wei; Anantha, P.; Bao, Shuyu; Lee, Kwang Hong; Guo, Xin; Hu, Ting; Zhang, Lin; Wang, Hong; Soref, Richard; Tan, Chuan Seng |
| 2017 | Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications | Lee, Kwang Hong; Bao, Shuyu; Lin, Yiding; Wang, Yue; Li, Wei; Zhang, Lin; Michel, Jurgen; Fitzgerald, Eugene A.; Tan, Chuan Seng; Anantha, P. |
| | 2012 | Impact of PCB ground plane size on dual-band antenna performance | Zhang, Lin; See, Kye Yak; Zhang, Yue Ping |
| 2020 | Insights into the origins of guided microtrenches and microholes/rings from Sn segregation in germanium–tin epilayers | Wu, Shaoteng; Zhang, Lin; Son, Bongkwon; Chen, Qimiao; Zhou, Hao; Tan, Chuan Seng |
| | 2012 | Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief | Ghosh, Kaushik; Zhang, Jiye; Zhang, Lin; Dong, Yuanwei; Li, Hong Yu; Tan, Cher Ming; Xia, Guangrui; Tan, Chuan Seng |
| 2002 | Investigation on the formation of C54-TiSi2 used as contact metallization in ULSI application | Zhang, Lin |
| 2020 | Metal-semiconductor-metal GeSn photodetectors on silicon for short-wave infrared applications | Ghosh, Soumava; Lin, Kuan-Chih; Tsai, Cheng-Hsun; Kumar, Harshvardhan; Chen, Qimiao; Zhang, Lin; Son, Bongkwon; Tan, Chuan Seng; Kim, Munho; Mukhopadhyay, Bratati; Chang, Guo-En |
| 2018 | Spiral waveguides on germanium-on-silicon nitride platform for mid-IR sensing applications | Li, Wei; Anantha, P.; Lee, Kwang Hong; Qiu, Hao Dong; Guo, Xin; Goh, Simon Chun Kiat; Zhang, Lin; Wang, Hong; Soref, Richard A.; Tan, Chuan Seng |
| 2013 | A study on open-end equity fund position and index return | Zhang, Lin; Song, Shuang; Jin, Yelei |
| | 2012 | Through silicon via fabrication with low-κ dielectric liner and its implications on parasitic capacitance and leakage current | Zhang, Lin; Lim, Dau Fatt; Li, Hong Yu; Gao, Shan; Tan, Chuan Seng |
| 2014 | Through-silicon-via (TSV) design, fabrication and characterization for 3D IC applications | Zhang, Lin |
