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Showing results 23340 to 23359 of 23801 < previous   next >
Issue DateTitleAuthor(s)
2012W band passive circuits design using substrate integrated waveguide (SIW)Wang, Youzi.
2018A W-Band backward-wave oscillator based on planar helix slow wave structureKumar, Ajith M. M.; Aditya, Sheel; Wang, Shaomeng
 2012W-band monopole antenna-in-system design approached on molding compound materialJin, Cheng; Li, Rui; Zhang, Xiaowu; Alphones, Arokiaswami
 2013W-band rectangular ring-bar structure with straight-edge connectionsAditya, Sheel; Chua, Ciersiang; Lau, Yue Ying
2018A W-band switch-less Dicke receiver for millimeter-wave imaging in 65nm CMOSFeng, Guangyin; Yi, Xiang; Meng, Fanyi; Boon, Chirn Chye
 2021W-type normal dispersion thulium-doped fiber-based high-energy all-fiber femtosecond laser at 1.7  µmChen, Shaoxiang ; Chen, Yuhao; Liu, Kun; Sidharthan, Raghuraman; Li, Huizi; Chang, Chen Jian; Wang, Qi Jie; Tang, Dingyuan; Yoo, Seongwoo
2017W/Cu thin film infrared reflector for TiNxOy based selective solar absorber with high thermal stabilityLiu, Y. C.; Liu, Z.; Yang, H. Y.; Zhang, Jun; Chen, Tupei
 2021WaC : first results on practical side-channel attacks on commercial machine learning acceleratorWon, Yoo-Seung; Chatterjee, Soham; Jap, Dirmanto; Basu, Arindam; Bhasin, Shivam
2013Wafer fabrication cycle time reportCheng, Hao Fen.
2000Wafer level electromigration reliability study of deep submicron via for multilevel metallizationLoh, Wye Boon.
 2013Wafer level silicon mould fabrication and imprinting of high density microstructuresWong, T. I.; Ong, H. Y.; Lu, H. J.; Tse, M. S.; Quan, C. G.; Ng, S. H.; Zhou, X.
2012Wafer-level fine pitch Cu-Cu bonding for 3-D stacking of integrated circuitsPeng, Lan
 2012Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliabilityPeng, L.; Fan, Ji; Li, Kwok Hung; Tan, Chuan Seng
2002Wafer-level isothermal electromigration study on deep sub-micron interconnect metallizationLim, Yeow Kheng.
2022Wafer-scale demonstration of low-loss (∼0.43 dB/cm), high-bandwidth (>38 GHz), silicon photonics platform operating at the C-bandSia, Brian Jia Xu; Li, Xiang; Wang, Jiawei; Wang, Wanjun; Qiao, Zhongliang; Guo, Xin; Lee, Chee Wei; Sasidharan, Ashesh; Gunasagar, S.; Littlejohns, Callum G.; Liu, Chongyang; Reed, Graham T.; Ang, Kian Siong; Wang, Hong
2022Wafer-scale deposition of transition metal Dichalcogenide filmAng, Nicole Ru Xuan
2015A wafer-scale graphene and ferroelectric multilayer for flexible and fast-switched modulation applicationsZhu, Minmin; Wu, Jing; Du, Zehui; Tay, Roland Yingjie; Li, Hongling; Özyilmaz, Barbarous; Teo, Edwin Hang Tong
2022Wafer-scale growth of vertical-structured SnSe₂ nanosheets for highly sensitive, fast-response UV–Vis–NIR broadband photodetectorsChen, Zhiyong; Xiong, Lei; Li, Guangyuan; Wei, Lei; Yang, Chunlei; Chen, Ming
2023Wafer-scale nanostructured black silicon with morphology engineering via advanced Sn-assisted dry etching for sensing and solar cell applicationsWu, Shaoteng; Chen, Qimiao; Zhang, Lin; Ren, Huixue; Zhou, Hao; Hu, Liangxing; Tan, Chuan Seng
 2019Wafer-scale vertically aligned carbon nanotubes for broadband terahertz wave absorptionSun, Leimeng; Zhu, Minmin; Zhao, Chun; Song, Peiyi; Wang, Yurong; Xiao, Dongyang; Liu, Huafeng; Tsang, Siu Hon; Teo, Edwin Hang Tong; Hu, Fangjing; Tu, Liangcheng
Showing results 23340 to 23359 of 23801 < previous   next >