Browsing by Author
Balaraju, J. N.
Showing results 1 to 2 of 2
| Issue Date | Title | Author(s) |
 | 2014 | Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability | Yang, Ying; Huang, Yizhong; Liu, Hai; Chen, Zhong; Balaraju, J. N. |
| 2014 | Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation | Yang, Ying; Balaraju, J. N.; Huang, Yizhong; Tay, Yee Yan; Shen, Yiqiang; Tsakadze, Zviad; Chen, Zhong |
