Showing results 1 to 20 of 76
next >
| Issue Date | Title | Author(s) |
 | 2021 | 3D printing of transparent spinel ceramics with transmittance approaching the theoretical limit | Wang, Haomin; Liu, Li Ying; Ye, Pengcheng; Huang, Zhangyi; Ng, Andrew Yun Ru; Du, Zehui; Dong, Zhili; Tang, Dingyuan; Gan, Chee Lip |
| | 2014 | Au-In-based hermetic sealing for MEMS packaging for down-hole application | Vivek, Chidambaram; Chen, Bangtao; Gan, Chee Lip; Daniel, Rhee Min Woo |
| 2022 | Bond engineering of molecular ferroelectrics renders soft and high-performance piezoelectric energy harvesting materials | Hu, Yuzhong; Parida, Kaushik; Zhang, Hao; Wang, Xin; Li, Yongxin; Zhou, Xinran; Morris, Samuel Alexander; Liew, Weng Heng; Wang, Haomin; Li, Tao; Jiang, Feng; Yang, Mingmin; Alexe, Marin; Du, Zehui; Gan, Chee Lip; Yao, Kui; Xu, Bin; Lee, Pooi See; Fan, Hong Jin |
| 2017 | Characterisation of defects generated during constant current InGaN-on-silicon LED operation | Made, Riko I; Gao, Yu; Syaranamual, G. J.; Sasangka, W. A.; Zhang, Li; Nguyen, Xuan Sang; Tay, Yee Yan; Herrin, Jason Scott; Thompson, C. V.; Gan, Chee Lip |
| | 2021 | CMOS-compatible Ti/TiN/Al refractory ohmic contact for GaAs heterojunction bipolar transistors grown on Ge/Si substrate | Wang, Yue; Loke, Wan Khai; Gao, Yu; Lee, Kwang Hong; Lee, Kenneth Eng Kian; Gan, Chee Lip; Tan, Chuan Seng; Fitzgerald, Eugene A.; Yoon, Soon Fatt |
| 2016 | Comprehensive laser sensitivity profiling and data register bit-flips in 65 nm FPGA | He, Wei; Breier, Jakub; Bhasin, Shivam; Jap, Dirmanto; Ong, Hock Guan; Gan, Chee Lip |
| | 2010 | Controlled synthesis of copper-silicide nanostructures | Li, Shaozhou; Cai, Hui; Gan, Chee Lip; Guo, Jun; Dong, Zhili; Ma, Jan |
| | 2022 | Copper-nanoparticle-coated fabrics for rapid and sustained antibacterial activity applications | Gonçalves, Rui A.; Ku, Joanne W. K.; Zhang, Hao; Salim, Teddy; Oo, Guodong; Zinn, Alfred A.; Boothroyd, Chris; Tang, Richard M. Y.; Gan, Chee Lip; Gan, Yunn-Hwen; Lam, Yeng Ming |
| 2016 | Crystal orientation dependence of the stress-induced martensitic transformation in zirconia-based shape memory ceramics | Zeng, Xiao Mei; Lai, Alan; Gan, Chee Lip; Schuh, Christopher A. |
| 2014 | Customized glass sealant for ceramic substrates for high temperature electronic application | Sharif, Ahmed; Gan, Chee Lip; Chen, Zhong |
| 2015 | Decapsulation of 3D multi-die stacked package | Kor, Katherine Hwee Boon; Liu, Q.; Siah, Yu Wen; Gan, Chee Lip |
| 2018 | Descrambling of embedded SRAM using a laser probe | Chef, Samuel; Chua, Chung Tah; Tay, Jing Yun; Siah, Yu Wen; Bhasin, Shivam; Breier, J.; Gan, Chee Lip |
| | 2012 | Effect of copper TSV annealing on via protrusion for TSV wafer fabrication | Heryanto, A.; Putra, W. N.; Trigg, Alastair David; Gao, S.; Kwon, W. S.; Che, Faxing; Ang, X. F.; Wei, J.; Made, Riko I.; Gan, Chee Lip; Pey, Kin Leong |
| 2013 | Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits | Made, Riko I.; Peng, Lan; Li, Hong Yu; Gan, Chee Lip; Tan, Chuan Seng |
| 2016 | Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects | Gan, Chee Lip; Tan, Chuan Seng; Dai, Y. Y.; Ng, M. Z.; Anantha, P.; Lin, Y. D.; Li, Z. G. |
| 2007 | Enhanced photoluminescence of ZnO/Er2O3 core-shell structure nanorods synthesized by pulsed laser deposition | Yuan, C. L.; Li, Shaozhou; Gan, Chee Lip; Cai, Hui; Guo, Jun; Lee, Pooi See; Ma, Jan |
| 2017 | Enhanced shape memory and superelasticity in small-volume ceramics: a perspective on the controlling factors | Zeng, Xiaomei; Du, Zehui; Schuh, Christopher A.; Gan, Chee Lip |
| 2009 | Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects | Made, Riko I.; Thompson, Carl V.; Leong, H. L.; Li, H. Y.; Gan, Chee Lip; Pey, Kin Leong |
| 2012 | Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits | Made, Riko I.; Thompson, Carl V.; Gan, Chee Lip; Yan, Li Ling; Kor, Katherine Hwee Boon; Chia, Hong Ling; Pey, Kin Leong |
| | 2011 | Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits | Yan, Li Ling; Gan, Chee Lip; Kor, Katherine Hwee Boon; Chia, Hong Ling; Pey, Kin Leong; Made, Riko I.; Thompson, Carl V. |
