Browsing by Subject DRNTU::Engineering::Materials::Electronic packaging materials

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Issue DateTitleAuthor(s)
 2014Au-In-based hermetic sealing for MEMS packaging for down-hole applicationVivek, Chidambaram; Chen, Bangtao; Gan, Chee Lip; Daniel, Rhee Min Woo
2009Bonding for 3D ICs and heterogeneous systemChia, Hong Ling.
2013Carbon inverse opal entrapped with electrode active nanoparticles as high-performance anode for lithium-ion batteriesHuang, Xin; Chen, Jing; Lu, Ziyang; Yu, Hong; Yan, Qingyu; Hng, Huey Hoon
2009Characterization and electrical properties of Ni-NiO-Ni heterojunction nanowiresZhang, Cheng
 2013Cu–Cu hermetic seal enhancement using self-assembled monolayer passivationPeng, L.; Leong, K. C.; Lim, Dau Fatt; Fan, Ji; Tan, Chuan Seng
2012Development of magnetic current imaging for the failure analysis of 3D package technologyKor, Katherine Hwee Boon.
2000Development of polyurethane rubber- modified epoxy resin for microelectronics packagingBhangale Sunil Madhukar.
2014Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnectionYang, Ying; Chen, Zhong; Hu, Xiao; Xu, Sha; Chan, Y. C.
2011Electrical characterization and modeling on mechanical strength of copper to copper bonds for three dimensional integrated circuitsI Made Riko
2011Electrical characterization of indium-tin based solder materialsAw, Jie Li
2014Electrical properties of AU-GE solder under high temperatureLau, Fu Long
 2012Electrical properties of textured (KNa)0.44Li0.06Nb0.84Sb0.06Ta0.1O3 thick filmsFu, Fang; Zhai, Jiwei; Xu, Zhengkui; Bai, Wangfeng; Kong, Ling Bing
2002Evaluation of electronics materialsGoh, Kok Hwee.
2014Experimental and theoretical study of nanotwinned copper fabricated by pulse-reverse electrodeposition for interconnect and through-silicon via (TSV) technologiesLin, Nay
2000Finite element analysis on overall mechanical properties of molding compounds in electronic packagingLeong, Sook Har.
 2012Fracture of Sn-Ag-Cu solder joints on Cu substrates : I. effects of loading and processing conditionsPang, John Hock Lye; Huang, Z.; Kumar, P.; Dutta, I.; Sidhu, R.; Renavikar, M.; Mahajan, R.
2013Glass frit hermetic encapsulation for harsh environment multi-chip module applicationLim, Jun Zhang
2014Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliabilityYang, Ying; Huang, Yizhong; Liu, Hai; Chen, Zhong; Balaraju, J. N.
2014Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formationYang, Ying; Balaraju, J. N.; Huang, Yizhong; Tay, Yee Yan; Shen, Yiqiang; Tsakadze, Zviad; Chen, Zhong
2006Investigation of failure mechanism in packaging of inkjet printer headTey, Ju Nie.