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Issue DateTitleAuthor(s)
2012W band passive circuits design using substrate integrated waveguide (SIW)Wang, Youzi.
 2012W(CO)5(L)-catalyzed cyclization of α-alkynyl-β-dicarbonyl derivatives : synthesis of methylenelactones, furans, and methylenecyclopentanesMeng, Xiangjian.; Kim, Sunggak.
1996W(h)ither national sovereignty : cultural identities in a global contextSreberny-Mohammadi, Annabelle
2018A W-Band backward-wave oscillator based on planar helix slow wave structureKumar, Ajith M. M.; Aditya, Sheel; Wang, Shaomeng
 2012W-band monopole antenna-in-system design approached on molding compound materialJin, Cheng; Li, Rui; Zhang, Xiaowu; Alphones, Arokiaswami
 2013W-band rectangular ring-bar structure with straight-edge connectionsAditya, Sheel; Chua, Ciersiang; Lau, Yue Ying
2018A W-band switch-less Dicke receiver for millimeter-wave imaging in 65nm CMOSFeng, Guangyin; Yi, Xiang; Meng, Fanyi; Boon, Chirn Chye
2017W/Cu thin film infrared reflector for TiNxOy based selective solar absorber with high thermal stabilityLiu, Y. C.; Liu, Z.; Yang, H. Y.; Zhang, Jun; Chen, Tupei
2014WabiSim, Shen-Wei
2013Wafer fabrication cycle time reportCheng, Hao Fen.
2000Wafer level electromigration reliability study of deep submicron via for multilevel metallizationLoh, Wye Boon.
 2013Wafer level silicon mould fabrication and imprinting of high density microstructuresWong, T. I.; Ong, H. Y.; Lu, H. J.; Tse, M. S.; Quan, C. G.; Ng, S. H.; Zhou, X.
2012Wafer-level fine pitch Cu-Cu bonding for 3-D stacking of integrated circuitsPeng, Lan
 2012Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliabilityPeng, L.; Fan, Ji; Li, Kwok Hung; Tan, Chuan Seng
2002Wafer-level isothermal electromigration study on deep sub-micron interconnect metallizationLim, Yeow Kheng.
2015A wafer-scale graphene and ferroelectric multilayer for flexible and fast-switched modulation applicationsZhu, Minmin; Wu, Jing; Du, Zehui; Tay, Roland Yingjie; Li, Hongling; Özyilmaz, Barbarous; Teo, Edwin Hang Tong
2018Wafer-scale vertically aligned carbon nanotubes locked by in situ hydrogelation toward strengthening static and dynamic compressive responsesJing, Lin; Li, Hongling; Tay, Roland Yingjie; Lin, Jinjun; Tsang, Siu Hon; Teo, Edwin Hang Tong; Tok, Alfred Iing Yoong
2010Wage differentials based on trade and globalisation.Chen, Constance RuYun.; Chia, Cheryl Simin.; Lee, Huiyi.
2011Wage discrimination amongst maids in Singapore.Xu, Darius JunLing.; Leong, Daphne Qian Qian.
2016"Wage growth must be offset by productivity growth" The determinants of real unit labour costs : a case of Singapore's manufacturing sectorThomasz, Ryan Joel; Lim, Melissa Jie Yi; Chua, Jeremy Kun Da