Academic Profile

Dr Gan is a Professor at the School of Materials Science and Engineering (MSE), Nanyang Technological University. He is currently the Associate Provost (Undergraduate Education) and Executive Director of Office of Research & Technology in Defence & Security (ORTDS). He is also a Fellow of Renaissance Engineering Programme (REP), as well as a Fellow of NTU Teaching Excellence Academy. He had previously held the position of Assistant Chair of Alumni and Head of Materials Science Division in School of MSE, Chairman of NTU Teaching Council, Director of REP, Director of Temasek Laboratories@NTU and Deputy Associate Provost (Undergraduate Education). Dr Gan was awarded the National Day Award Bronze Medal (Administration) in 2013, the Nanyang Education Award (University, Gold) in 2015, the Defence Technology Prize (Team R&D) in 2016, and the Defence Technology Prize (Individual R&D) in 2018.

Dr Gan received his B.Eng (Electrical) from the National University of Singapore in 1999, and Ph.D in Advanced Materials for Micro- and Nano-Systems under the Singapore-MIT Alliance Program (SMA) in 2003. His research interests include the reliability study of GaN-on-Si devices, failure analysis of microelectronics devices, development of advanced packaging materials and technology for harsh environment electronics, and development of ceramic pastes for 3D printing. He has received a number of best paper and poster awards at international conferences, as well as being an invited, keynote and plenary speaker at these conferences. His research on using copper nanostructures for low temperature bonding in electronics packaging and other applications has led to the spin-off of a NTU start-up company, Kuprion Inc. in 2016.

Outside of NTU, Dr Gan is a Senior Member of IEEE and past Chairman of IEEE Singapore Reliability/ED/CPMT joint chapter. He is also currently the Chairman of the International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Board.
Prof Gan Chee Lip.jpg picture
Prof Gan Chee Lip
Associate Provost (Undergraduate Education)
Professor, School of Materials Science & Engineering
Director, CSA-NTU Joint Center (CNJC)
Executive Director, Office of Research and Technology in Defence and Security (ORTDS)

• Hardware (i.e. electronics/microelectronics) assurance and security
• Microelectronics failure analysis and reliability (e.g. interconnects, III-V devices, electronic packages)
• Packaging technology for harsh environment electronics (e.g. copper nanoparticles bonding, high temperature encapsulant)
• 3D printing of ceramics (e.g. alumina, zirconia, transparent ceramics)
  • [NRF/NCR/CFACore] Cyber Forensics & Assurance Core R&D Programme

  • [NRF/NCR/CFAMgt] Cyber Forensics & Assurance Project Management

  • Application Development Of NanoCu Technology

  • Cyber Security Agency (CSA) Funding to NTU for National Integrated Centre for Evaluation (NICE)

  • Effect of High Frequency and High Voltage Stress on Epoxy Mold Compound

  • Hardware Assurance Phase II

  • Pressureless, Ultrafast Sintering of Advanced Ceramics with Complex Shapes


  • Research and Development of Advanced Imaging Techniques for Semiconductor Devices

  • The Management and Maintenance of the Microelectronics Failure Analysis Lab Goco Facility
  • H.M. Wang, L.Y. Liu, P. Ye, Z. Huang, A. Ng, Z.H. Du, Z.L. Dong. D.Y. Tang and C.L. Gan, “3D printing of transparent spinel ceramics with transmittance approaching theoretical limit,” Advanced Materials, (2021).

  • Z.H. Du, X.R. Zhou, P.C. Ye, X.M. Zeng and C.L. Gan, “Shape-Memory Actuation in Aligned Zirconia Nanofibers for Artificial Muscle Applications at Elevated Temperatures,” ACS Applied Nano Materials, vol. 3(3), p. 2156-2166, (2020).

  • Y. Gao, W.A. Sasangka, C.V. Thompson and C.L. Gan, “Effects of forward gate bias stressing on the leakage current of AlGaN/GaN high electron mobility transistors,” Microelectronics Reliability, vol. 100, Art. No. UNSP 113432, (2019).

  • E.J.R. Phua, M. Liu, B.K. Cho, Q. Liu, S. Amini, X. Hu and C.L. Gan, “Novel high temperature polymeric encapsulation material for extreme environment electronics packaging,” Materials & Design, vol. 141, p. 202-209, (2018).

  • X.M. Zeng, Z.H. Du, C.A. Schuh, and C.L. Gan, “Enhanced shape memory and superelasticity in small-volume ceramics: a perspective on the controlling factors,” MRS Communications, vol. 7 (4), p. 747-754, (2017).

  • W.A. Sasangka, G.J. Syaranamual, Y. Gao, R. I Made, C.L. Gan and C.V. Thompson, “Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation,” Microelectronics Reliability, vol. 76 (SI), p. 287-291, (2017).

  • R.I Made, Y. Gao, G.J. Syaranamual, W.A. Sasangka, L. Zhang, X.S. Nguyen, Y.Y. Tay, J.S. Herrin, C.V. Thompson and C.L. Gan, “Characterisation of defects generated during constant current InGaN-on-silicon LED operation,” Microelectronics Reliability, vol. 76 (SI), p. 561-565, (2017)

  • Z.H. Du, P.C. Ye, X.M. Zeng, C.A. Schuh, N. Tamura, X.R. Zhou and C.L. Gan, “Synthesis of monodisperse CeO2-ZrO2 particles exhibiting cyclic superelasticity over hundreds of cycles,” J. of the American Ceramic Society, vol. 100 (9), p. 4199 – 4208, (2017). #

  • X.M. Zeng, Z.H. Du, N. Tamura, **Q. Liu, C.A. Schuh and C.L. Gan, “In-situ studies on martensitic transformation and high-temperature shape memory in small volume zirconia,” Acta Materialia, vol. 134, p. 257 – 266, (2017).

  • Z.H. Du, X.M. Zeng, Q. Liu, C.A. Schuh and C.L. Gan, “Superelasticity in micro-scale shape memory ceramic particles,” Acta Materialia, vol. 123, p. 255-263, (2017).

  • C.T. Chua, H.G. Ong, K. Sanchez, P. Perdu and C.L. Gan, “Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop,” Microelectronics Reliability, vol. 64 (SI), p. 199-203, (2016).

  • X.M. Zeng, A. Lai, C.A. Schuh and C.L. Gan, “Crystal orientation dependence of the stress-induced martensitic transformation in zirconia-based shape memory ceramics,” Acta Materialia, vol. 116, p. 124-135, (2016).

  • S. Chef, S. Jacquir, K. Sanchez, P. Perdu, S. Binczak and C.L. Gan, “Unsupervised learning for signal mapping in dynamic photon emission,” Microelectronics Reliability, vol. 55 (9-10), p. 1564-1568, (2015).

  • A. Lai, Z.H. Du, C.L. Gan and C.A. Schuh, “Shape memory and superelastic ceramics at small scales,” Science, vol. 341 (6153), p. 1505-1508, (2013).

  • Leong HL, Gan CL, Made RI, Thompson CV, Pey KL, Li HY. (2009). Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects. Journal of Applied Physics, 105(3), Article Number: 033514.

  • Leong HL, Gan CL, Thompson CV, Pey KL, Li HY. (2009). Electromigration-induced bond improvement for three-dimensional integrated circuits. Applied Physics Letters, 94(8), Article Number: 081901.

  • M.K. Lim, C.L. Gan, T.L. Tan, Y.C. Ee, C.M. Ng, B.C. Zhang, and J.B. Tan. (2008). Effects of Pulsed Current on Electromigration Lifetime. (pp. 72-77).