Academic Profile

Chirn Chye Boon (M’09-SM’10) received B.E. (Hons.) (Elect.) in 2000 and Ph.D. (Elect. Eng.) in 2004 from Nanyang Technological University (NTU), Singapore. Since 2005, Chirn Chye has been with NTU where he is currently an Associate Professor. Before that, he was with Advanced RFIC (Singapore), where he worked as a Senior Engineer.
He is the Programme Director for RF and MM-wave research in the S$50million research centre of excellence, VIRTUS (NTU) since March 2010. He is the Principal Investigator for research grants of over S$13 million. He is a key NTU-team members of MIT-NTU joint collaboration project “Low Energy Electronic Systems”, under Singapore-MIT Alliance for Research and Technology (SMART) with a grant total of S$25million. He is also a key member of an Industry Alignment Fund (IAF-PP) on “Next-Generation V2X” with a grant total of S$21million. He is a winner of Year-2 Teaching Excellence Award and Commendation Award for Excellent Teaching Performance, EEE, NTU.
He is an Associate Editor for the IEEE Transactions on Very Large Scale Integration (VLSI) Systems and the IEEE Electron Devices Letters Golden Reviewer. He specializes in the areas of radio frequency (RF) & MM-wave circuits design for Communications applications. He has conceptualized, designed and silicon-verified many circuits/chips resulting in over 160 refereed publications and over 30 patents in the fields of RF and MM-wave. He is a co-author of the book “Design of CMOS RF Integrated Circuits and Systems” and “CMOS Millimeter-Wave Integrated Circuits for Next Generation Wireless Communication Systems (World Scientific Publishing).

Other Awards:

· FIRST Singapore ISSCC Silkroad Award paper winner (2013). ISSCC is the world TOP IC conference..

• IEEE Electron Devices Letters GOLDEN REVIEWER 2012

• IEEE Senior Member (2010)

• Represents NTU for the Asia Pacific Economic Cooperation SCIENCE PRIZE for INNOVATION, RESEARCH and EDUCATION (ASPIRE)

• Year-2 Teaching Excellent Award, EEE, NTU (2012) : For Lecture of 639 students.

• Best Project of Design Innovation Project Competition, EEE, NTU (2012)
eccboon_1_2.JPG picture
Assoc Prof Boon Chirn Chye
Associate Professor, School of Electrical & Electronic Engineering

Please See link below for more publications and awards.
PI: WP1: Transceiver Development Applicable for Hybrid “C-V2X+DSRC” V2X-System, S$2,889.900, 1 November 2019 to 31 October 2022, A*STAR (STAT Board), SERC A19D6a0053.

PI: Keysight Technologies Singapore – NTU Joint R&D: Transceiver test and development applicable for V2X-System and mmW, S$1,783.750, 22 January 2020 to 21 January 2023, Keysight Technologies Singapore (Industry).

PI: LEES III-V + CMOS Circuits & System towards Commercialization, S$364,800, 1 July 2019 to 31 December 2021, LEES-SMART-IRG (SMART No. II-16 LEES IRG), Phase II.

PI: Industry: Wireless Heterogeneous Network Transceiver Chipset for Content-Driven Transmission of Learning Media (SLE-RP3) Research Area (SLE), 1st July 2016 to 30th June 2021.

PI: Monolithic Terahertz Passive Components in Advanced CMOS Technology: From Fundamental Understandings to Integrated Circuit Applications, 1st November 2016 to 31st October 2018.

PI: Industry: Circuit Design for GaN Based DC-DC Converter Power, 1st June 2016 to 31st December 2018..

Industry: An Integrated Platform Approach Towards Non-Invasive Continuous Blood Glucose Monitoring Addressing Clinical Need for Early Diagnosis and Improved Compliance, 1st July 2016 to 30th July 2018.

PI: Industrial Grant (Fortune 500 Company) 10GiFi research & development of ultra-wideband RF transceiver, S$927,840.00, 15th July 2014 to 14th July 201.

PI: High Thermal Resolution Ultra-Low Power Integrated Imager: Fund. Issues in CMOS, $840,000, July 2013 to June 2016, AcRF Tier 2 MOE.

PI: Project 2: Electronic Circuit Design, Communication, S$391,560, April. 2012 to March 2013, LEES-SMART-IRG.

PI: Project 2: Electronic Circuit Design, Communication, S$376,200, April. 2013 to March 2014, LEES- SMART-IRG. Due to his excellent work and performance, he was again awarded this subcontract.

PI: Project 2: Electronic Circuit Design, Communication, S$836,400, April. 2014 to March 2016, LEES-SMART-IRG.

Recently, due to the outstanding feedback on Jan 2014 LEES Annual Review Meeting, he was further awarded a large subcontract amount of S$836,400 as PI under the “Low Energy Electronic Systems” from April 2014 to March 2016. LEES Annual Review Meeting is attended by all the PIs and Scientific Advisory Board (SAB) members which include Prof. Timothy David Sands who was recently appointed as President of Virginia Tech, USA.

PI: Ultra-low Power Fully Integrated CMOS 24GHz Receiver, $0.323mil, March 2008 to February 2011, AcRF Tier 1 MOE.

PI: Batteryless Flexible Transceiver for Biomedical Applications, $1,186,270 including scholarships), May 2009 to April 2012, AcRF Tier 2 MOE.

Co-PI: An Ultra Low-Power RFIC Chip For Wireless and Communication Applications S$1.2 mil, March 2006 to February 2009, funded by Agency for Science, Technology and Research (A*STAR).

Co-PI: System-on-chip: Realization of Software Radio, S$0.3 mil, 3 December 2008 to 2 December 2009, University of Electronic Science and Technology (UEST) of China-NTU Joint R&D, jointly funded by UEST and NTU.

Co-PI: An Ultra Low-Power RF Transceiver Chip towards a New Paradigm of Life Quality, S$0.25 mil, 3 December 2008 to 2 December 2009, NRF.

Key Collaborator: “Low Energy Electronic Systems” which has won the Singapore-MIT Alliance for Research and Technology (SMART) International Research Grant (IRG) proposal with a grant total of S$25million.

Various JIP programs.
  • CMOS Terahertz Plasmonic Interconnect towards Tera-scale Computing

  • LEES III-V + CMOS Circuits & System towards Commercialization

  • Next-Generation V2X Network Architecture and Ecosystem for Smart Mobility

  • Transceiver Test and Development Applicable for V2X-System and mmW
  • Y. Dong, C. C. Boon, et. Al. "A Wideband dB-linear Variable-Gain Amplifier With a Compensated Negative Pseudo-Exponential Generation Technique," IEEE Transactions on Microwave Theory and Techniques, vol. 69, no. 6, pp. 2809-2821, Jun. 2021. (I.F=3.176) DOI: 10.1109/TMTT.2021.3058266 (CV2X) ##

  • Z. Liu, C. C. Boon, et. Al. "A 0.061-mm2 1–11-GHz Noise-Cancelling Low-Noise Amplifier Employing Active Feedforward with Simultaneous Current and Noise Reduction," IEEE Transactions on Microwave Theory and Techniques, vol.69, no. 6, pp. 3093-3106, Jun. 2021. (I.F=3.176) DOI: 10.1109/TMTT.2021.3061290 (CV2X)

  • B. Liu, C. C. Boon, M. Mao, P. Choi, and T. Guo, ”A 2.4-6 GHz Broadband GaN Power Amplifier for 802.11ax Application”, IEEE Transactions on Circuits and Systems I, Accepted vol. 68, no. 6, pp. 2404-2417, Jun. 2021. (LEES) DOI: 10.1109/TCSI.2021.3073345##

  • K.T. Yang, C. C. Boon, *G.Y. Feng, *C.Y. Li, *Z. Liu, *X. Yi, *Y. Dong, *A. Zhou, *X.Y. Wang, “A 1.75dB NF 25mW 5GHz Transformer-Based Noise Cancelling CMOS Receiver Front-End", International Solid-State Circuits Conference (ISSCC), San Francisco, USA, accepted, Feb. 2021. (DE)

  • K.T. Yang, **X. Yi, C.C. Boon, **Z.P. Liang, **G.Y. Feng, **C.Y. Li, **B. Liu, "A Parallel Sliding-IF Receiver Front-End with Sub-2 dB Noise Figure for 5-6 GHz WLAN Carrier Aggregation," IEEE Journal of Solid State Circuits, vol. 56, no. 2, pp. 392-403, Feb. 2021. Digital Object Identifier: 10.1109/JSSC.2020.3014333 (I.F=3.063) (HW)