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      Toughening of epoxies by covalently anchoring triazole-functionalized stacked-cup carbon nanofibers

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      manuscript_composites science and technology.pdf (1.840Mb)
      Author
      Liu, Wanshuang
      Kong, Junhua
      Toh, Eric Weilong
      Zhou, Rui
      Ding, Guoqiang
      Huang, Shu
      Dong, Yuliang
      Lu, Xuehong
      Date of Issue
      2013
      School
      School of Materials Science and Engineering
      Version
      Accepted version
      Abstract
      Novel triazole-functionalized carbon nanofibers (m-CNFs) were prepared by one-step arylation with diazonium salts generated in situ. Microscopic observations indicate that m-CNFs exhibit significantly improved dispersibility in a high-performance epoxy resin compared with pristine CNFs (p-CNFs). The results of DSC and SEM show evidence of interfacial reaction and a more robust interface between m-CNFs and the epoxy matrix. Thermal and mechanical properties of two CNF/epoxy composites were systematically studied at different filler loadings. The results show that both CNF fillers could reinforce the epoxy matrix without sacrificing their thermal properties. Benefiting from the improved dispersibility and interfacial interaction, the ability of m-CNFs in toughening the epoxy resin is clearly superior to p-CNFs. The addition of only 0.4 wt% m-CNFs gives 41 and 80% enhancement in critical stress intensity factor (KIC) and the critical strain energy release rate (GIC), respectively.
      Type
      Journal Article
      Series/Journal Title
      Composites science and technology
      Rights
      © 2013 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Composites Science and Technology, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at DOI: [http://dx.doi.org/10.1016/j.compscitech.2013.05.009].
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      http://dx.doi.org/10.1016/j.compscitech.2013.05.009
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