Slurry flow visualisation of chemical mechanical polishing based on a computational fluid dynamics model
Author
Tian, Y. B.
Lai, S. T.
Zhong, Z. W.
Date of Issue
2012School
School of Mechanical and Aerospace Engineering
Research Centre
Singapore Institute of Manufacturing Technology
Abstract
In this work, we developed a computational fluid dynamics (CFD) model to simulate the slurry flow between the wafers and pad during the chemical mechanical polishing (CMP) process under a multiple-wafer configuration. A serial of simulations were carried out to visualise slurry flow and explore the effects of the process variables concerned on the flow velocity and pressure distributions beneath the wafers. Through the model and simulation, the flow field characteristics were obtained and analyzed under different operating conditions. The results can provide an insight into a fundamental understanding of the slurry flow behaviours under the multiple-wafer configuration and some useful implications for the selection of practical polishing variables.
Type
Journal Article
Series/Journal Title
Advanced materials research
Rights
© 2012 Trans Tech Publications, Switzerland.
Collections
http://dx.doi.org/10.4028/www.scientific.net/AMR.565.324
Get published version (via Digital Object Identifier)