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      On thermo-mechanical reliability of plated-through-hole (PTH)

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      Author
      Su, Fei
      Mao, Ronghai
      Xiong, Ji
      Zhou, Kun
      Zhang, Zheng
      Shao, Jiang
      Xie, Cunyi
      Date of Issue
      2011
      School
      School of Mechanical and Aerospace Engineering
      Abstract
      The mechanical properties of plated copper in plated-through-hole (PTH) were investigated experimentally by a thermo-mechanical analyzer, a nano-indenter, and an acoustic emission instrument. Coefficients of fatigue life prediction models for plated copper have been determined by different failure criteria. Afterwards thermal fatigue test of PTH at three different diameters were performed, and Weibull statistics was employed to evaluate the fatigue life of samples under different failure criteria. Finally, the strain variation of PTH during thermal cycle has been simulated by the finite element analysis (FEA) so as to predict its fatigue life by the selected models. From the comparison of the estimated fatigue life and its experimental results, it is found that the error can be minimized to be within 100%, provided that the drifting of electrical resistance by 20% is used as failure criteria and total strain amplitude is used as control variable in fatigue life prediction model. Based on these findings, design of PTH in printed circuit board (PCB) can be optimized by FEA. It is concluded that fatigue life of PTH will increase with lesser PCB layers, smaller depth-to-diameter ratio, higher PTH density and thicker plated copper.
      Subject
      DRNTU::Engineering::Mechanical engineering
      Type
      Journal Article
      Series/Journal Title
      Microelectronics reliability
      Rights
      © 2011 Elsevier Ltd.
      Collections
      • MAE Journal Articles
      http://dx.doi.org/10.1016/j.microrel.2011.11.021
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