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|Title:||Large-eddy simulation of thermal fatigue in a mixing tee||Authors:||Ming, Tingzhen.
|Keywords:||DRNTU::Engineering::Electrical and electronic engineering||Issue Date:||2012||Source:||Ming, T., & Zhao, J. (2012). Large-eddy simulation of thermal fatigue in a mixing tee. International Journal of Heat and Fluid Flow, 37, 93-108.||Series/Report no.:||International journal of heat and fluid flow||Abstract:||Temperature fluctuations occur due to thermal mixing of hot and cold streams in the T-junctions of the piping system in nuclear power plants, which may cause thermal fatigue of piping system. In this paper, three-dimensional, unsteady numerical simulations of coolant temperature fluctuations at a mixing T-junction of equal diameter pipes were performed using the large eddy simulation (LES) turbulent model. The experiments used in this paper to benchmark the simulations were performed by Hitachi Ltd. The calculated normalized mean temperatures and fluctuating temperatures are in good agreement with the measurements. The influence of the time-step ranging from 100 Hz to 1000 Hz on the numerical simulation results was explored. The simulation results indicate that all the results with different frequencies agree well with the experimental data. Finally, the attenuation of fluctuation of fluid temperature was also investigated. It is found that, drastic fluctuation occurs within the range of less than L/D = 4.0; the fluctuation of fluid temperature does not always attenuate from the pipe center to the wall due to the continuous generation of vortexes. At the top wall, the position of L/D = 1.5 has a minimum normalized mean temperature and a peak value of root-mean square temperature, whereas at the bottom wall, the position having the same characteristics is L/D = 2.0.||URI:||https://hdl.handle.net/10356/85057
|ISSN:||0142-727X||DOI:||http://dx.doi.org/10.1016/j.ijheatfluidflow.2012.06.002||Rights:||© 2012 Elsevier Inc.||Fulltext Permission:||none||Fulltext Availability:||No Fulltext|
|Appears in Collections:||EEE Journal Articles|
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