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|Title:||Oxide-based RRAM : a novel defect-engineering-based implementation for multilevel data storage||Authors:||Gao, Bin
Kang, J. F.
Liu, L. F.
Liu, X. Y.
Wang, Z. R.
|Keywords:||DRNTU::Engineering::Electrical and electronic engineering||Issue Date:||2012||Source:||Kang, J. F., Gao, B., Chen, B., Liu, L. F., Liu, X. Y., Yu, H., et al. (2012). Oxide-Based RRAM: A Novel Defect-Engineering-Based Implementation for Multilevel Data Storage. 2012 4th IEEE International Memory Workshop.||Abstract:||A novel strategy based on defect engineering is proposed for high-performance multilevel data storage in oxide-based resistive random access memory (RRAM). Key innovations are (i) material-oriented cell engineering for desired modification of physical locations of generated oxygen vacancies in resistive switching layer and (ii) innovative operation scheme to control the distribution of oxygen vacancy conducting filaments during the switching. Excellent memory performance with four-level data storage is successfully demonstrated in hafnium-oxide-based RRAM devices, indicating the viability of the proposed engineering design strategy.||URI:||https://hdl.handle.net/10356/97328
|DOI:||http://dx.doi.org/10.1109/IMW.2012.6213664||Rights:||© 2012 IEEE.||Fulltext Permission:||none||Fulltext Availability:||No Fulltext|
|Appears in Collections:||EEE Conference Papers|
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