dc.contributor.authorHao, Yan
dc.contributor.authorAsundi, Anand Krishna
dc.date.accessioned2013-07-22T01:30:15Z
dc.date.available2013-07-22T01:30:15Z
dc.date.copyright2013en_US
dc.date.issued2013
dc.identifier.citationHao, Y., & Asundi, A. K. (2013). Impact of charge-coupled device size on axial measurement error in digital holographic system. Optics letters, 38(8), 1194-1196.en_US
dc.identifier.urihttp://hdl.handle.net/10220/11897
dc.description.abstractDigital holography (DH) is a 3D measurement technique with a theoretical axial resolution of better than 1-2 nm. However, practically, the axial resolution has been quoted to be in the range 10-20 nm. One possible reason is that the axial measurement error is much larger so that the theoretical axial resolution cannot be achieved. Until now the axial measurement errors of the DH system have not been thoroughly discussed. In this Letter, the impact of CCD chip size on the axial measurement error is investigated through both simulation and experiment. The results show that a larger CCD size reduces the axial measurement error and improves the measurement accuracy of edges.en_US
dc.language.isoenen_US
dc.relation.ispartofseriesOptics lettersen_US
dc.rights© 2013 Optical Society of America. This paper was published in Optics Letters and is made available as an electronic reprint (preprint) with permission of Optical Society of America. The paper can be found at the following official DOI: [http://dx.doi.org/10.1364/OL.38.001194]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.en_US
dc.subjectDRNTU::Engineering::Mechanical engineering
dc.titleImpact of charge-coupled device size on axial measurement error in digital holographic systemen_US
dc.typeJournal Article
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.identifier.doihttp://dx.doi.org/10.1364/OL.38.001194
dc.description.versionPublished versionen_US


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