Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/98189
Title: Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router
Authors: Ye, Yaoyao
Xu, Jiang
Wu, Xiaowen
Zhang, Wei
Liu, Weichen
Nikdast, Mahdi
Wang, Xuan
Wang, Zhehui
Wang, Zhe
Keywords: DRNTU::Engineering::Computer science and engineering
Issue Date: 2012
Source: Ye, Y., Xu, J., Wu, X., Zhang, W., Liu, W., Nikdast, M., et al. (2012). Thermal analysis for 3D optical network-on-chip based on a novel low-cost 6×6 optical router. 2012 IEEE Optical Interconnects Conference.
Abstract: We propose 3D mesh-based optical network-on-chip (ONoC) based on a novel low-cost 6×6 optical router, and quantitatively analyze thermal effects on the 3D ONoC. Evaluation results show that with the traditional thermal tuning technique using microheater, the average power efficiency of the 3D ONoC is about 2.7pJ/bit, while chip temperature varies spatially between 55°C and 85°C. In comparison, a new technique using the optimal device setting can improve the average power efficiency to 2.1pJ/bit. It is shown that in this particular case, the effectiveness of the two techniques is comparable. If we apply both techniques at the same time, the average power efficiency can be further improved to 1.3pJ/bit.
URI: https://hdl.handle.net/10356/98189
http://hdl.handle.net/10220/12118
DOI: http://dx.doi.org/10.1109/OIC.2012.6224422
Rights: © 2012 IEEE.
metadata.item.grantfulltext: none
metadata.item.fulltext: No Fulltext
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