dc.contributor.authorLiu, Zhifeng
dc.contributor.authorWang, Yun
dc.contributor.authorPeng, Xinli
dc.contributor.authorLi, Yabin
dc.contributor.authorLiu, Zhichao
dc.contributor.authorLiu, Chengcheng
dc.contributor.authorYa, Jing
dc.contributor.authorHuang, Yizhong
dc.identifier.citationLiu, Z., Wang, Y., Peng, X., Li, Y., Liu, Z., Liu, C., et al. (2012). Photoinduced superhydrophilicity of TiO 2 thin film with hierarchical Cu doping. Science and Technology of Advanced Materials, 13(2), 025001-.en_US
dc.description.abstractHydrophilic Cu–TiO2 thin films with a gradient in the Cu concentration were prepared on glass by layer-by-layer dip-coating from TiO2 precursors. The effects of the Cu doping on the structure and properties of TiO2 self-cleaning thin films are discussed. The Cu gradient markedly affects the hydrophilicity of the films, with the water contact angle significantly reduced compared with those of the pure or uniformly doped TiO2 thin films. This enhanced hydrophilicity is explained by the more efficient absorption of the solar light and by the reduced recombination of photoexcited electrons and holes in the TiO2 films containing a gradient of Cu dopants.en_US
dc.relation.ispartofseriesScience and Technology of Advanced Materialsen_US
dc.rights© 2012 National Institute for Materials Science. This paper was published in Science and Technology of Advanced Materials and is made available as an electronic reprint (preprint) with permission of National Institute for Materials Science. The paper can be found at the following official DOI: [http://dx.doi.org/10.1088/1468-6996/13/2/025001]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.en_US
dc.titlePhotoinduced superhydrophilicity of TiO2 thin film with hierarchical Cu dopingen_US
dc.typeJournal Article
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.description.versionPublished Version

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