Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realization
Tan, Chuan Seng
Lim, Dau Fatt
Li, Hong Yu
Date of Issue2012
IEEE International Workshop on Low Temperature Bonding for 3D Integration (3rd : 2012 : Tokyo, Japan)
School of Electrical and Electronic Engineering
Email Print Request Permissions In this invited paper, a non-UHV and non-corrosive method using self-assembled monolayer (SAM) to passivate Cu surface to prevent oxidation and contamination is investigated. The final goal is to enable low temperature Cu-Cu bonding for high density 3D IC realization.