Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/102285
Title: Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
Authors: Nai, S. M. L.
Xu, L. Y.
Wei, J.
Han, Yongdian
Jing, Hongyang
Tan, Cher Ming
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2012
Source: Han, Y., Jing, H., Nai, S. M. L., Xu, L. Y., Tan, C. M., & Wei, J. (2012). Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling. Intermetallics, 31, 72-78.
Series/Report no.: Intermetallics
Abstract: In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn–Ag–Cu (SAC) solder matrix, to form composite solders. Up to 0.05 wt.% of Ni-CNTs were successfully incorporated. The interfacial microstructure and shear strength of solders on Ni/Au finished Cu substrates were investigated after thermal cycling (from −40 °C to +125 °C) for up to 2000 cycles. The thermomechanical property results showed an improvement in thermal stability for the composite solders. Results also revealed that after soldering and thermal cycling, the interfacial IMC thickness of the unreinforced solder joint was observed to grow more significantly than that of the composite solder joints. Shear tests results revealed that both composite solder joints which were thermally cycled and as-soldered had better ultimate shear strength than their monolithic counterparts. The shear strength of all thermally cycled solder joints decreased with increasing thermal cycles.
URI: https://hdl.handle.net/10356/102285
http://hdl.handle.net/10220/16866
ISSN: 0966-9795
DOI: http://dx.doi.org/10.1016/j.intermet.2012.06.002
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:SIMTech Journal Articles

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