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|Title:||Thermal-mechanical design of sandwich SiC power module with micro-channel cooling||Authors:||Yin, Shan
Tseng, King Jet
|Keywords:||DRNTU::Engineering::Electrical and electronic engineering||Issue Date:||2013||Source:||Yin, S., Tseng, K. J., & Zhao, J. (2013). Thermal-mechanical design of sandwich SiC power module with micro-channel cooling. 2013 IEEE 10th International Conference on Power Electronics and Drive Systems (PEDS), 535-540.||Abstract:||A sandwich packaging structure of SiC power module for HEV application has been designed and numerically investigated by CFD study. The design has a micro-channel heat sink integrated in the back Cu-layer of DBC substrate. Doubleside cooling is adopted and liquid coolant (ethylene glycol, 105 °C) flows in opposite directions in the two heat sinks. Compared with wirebonding packaging, the proposed sandwich structure can almost double the cooling efficiency (thermal resistance 0.11 K/W) and temperature-distribution uniformity. Finite element analysis of thermal stress was further carried out to check that the CTE mismatch in the packaging has been minimized.||URI:||https://hdl.handle.net/10356/96479
|DOI:||http://dx.doi.org/10.1109/PEDS.2013.6527077||Fulltext Permission:||none||Fulltext Availability:||No Fulltext|
|Appears in Collections:||EEE Conference Papers|
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