Thermal-mechanical design of sandwich SiC power module with micro-channel cooling
Tseng, King Jet
Date of Issue2013
IEEE International Conference on Power Electronics and Drive Systems (10th : 2013 : Kitakyushu, Japan)
School of Electrical and Electronic Engineering
A sandwich packaging structure of SiC power module for HEV application has been designed and numerically investigated by CFD study. The design has a micro-channel heat sink integrated in the back Cu-layer of DBC substrate. Doubleside cooling is adopted and liquid coolant (ethylene glycol, 105 °C) flows in opposite directions in the two heat sinks. Compared with wirebonding packaging, the proposed sandwich structure can almost double the cooling efficiency (thermal resistance 0.11 K/W) and temperature-distribution uniformity. Finite element analysis of thermal stress was further carried out to check that the CTE mismatch in the packaging has been minimized.
DRNTU::Engineering::Electrical and electronic engineering