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Title: Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging
Authors: Yin, Shan
Tseng, King Jet
Zhao, Jiyun
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Issue Date: 2013
Source: Yin, S., Tseng, K. J., & Zhao, J. (2013). Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging. Applied Thermal Engineering, 52(1), 120-129.
Series/Report no.: Applied thermal engineering
Abstract: A single-phase, laminar flow, rectangular, and AlN-based micro-channel heat sink (MCHS) with water coolant has been designed and optimized for power electronics packaging. By fabricating micro-channels in the AlN-layer of direct bond copper, the heat conduction path is minimized and high cooling performance of micro-channels is utilized. The scaling effects, including temperature-dependent fluid properties, entrance effect, viscous dissipation and conjugate heat transfer, are considered. Comparison between CFD simulation by ANSYS Fluent and well-established analytical correlations is carried out and importance of entrance effect is emphasized. For the optimal geometry, the total thermal resistance of the AlN-based MCHS is 0.128 K/W at a pressure drop of 66.6 kPa. The conventional packaging structures, in which the Cu-based MCHS is bonded to the direct bond copper by solder or thermal interface material, are investigated to compare with the proposed structure. The proposed structure shows a reduction in thermal resistance by 15% and 80% respectively.
ISSN: 1359-4311
DOI: 10.1016/j.applthermaleng.2012.11.014
Rights: © 2013 Elsevier.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Journal Articles

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