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Title: Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects
Authors: Chip-Hong Chang
Wei Zhang
Hao Yu
Qian, Hanhua
Liang, Hao
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2013
Source: Qian, H., Liang, H., Chang, C.-H., Zhang, W., & Yu, H. (2013). Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects. 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC), 485-490.
Abstract: This paper presents a fast and accurate steady state thermal simulator for heatsink and microfluid-cooled 3D-ICs. This model considers the thermal effect of TSVs at fine-granularity by calculating the anisotropic equivalent thermal conductances of a solid grid cell if TSVs are inserted. Entrance effect of microchannels is also investigated for accurate modeling of microfluidic cooling. The proposed thermal simulator is verified against commercial multiphysics solver COMSOL and compared with Hotspot and 3D-ICE. Simulation results shows that for heatsink cooling, the proposed simulator is as accurate as Hotspot but runs much faster at moderate granularity. For microfluidic cooling, our proposed simulator is much more accurate than 3D-ICE in its estimation of steady state temperature and thermal distribution.
Rights: © 2013 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: [].
Fulltext Permission: open
Fulltext Availability: With Fulltext
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