Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/101400
Title: Performance analysis of an integrated piezoelectric ZnO sensor for detection of head–disk contact
Authors: Yuan, Yanhui
Du, Hejun
Chow, Kun Shyong
Zhang, Mingsheng
Yu, Shengkai
Liu, Bo
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Issue Date: 2013
Source: Yuan, Y., Du, H., Chow, K. S., Zhang, M., Yu, S., & Liu, B. (2013). Performance analysis of an integrated piezoelectric ZnO sensor for detection of head–disk contact. Microsystem Technologies, 19(9-10), 1449-1455.
Series/Report no.: Microsystem technologies
Abstract: Integrated capability for detection of head-disk contact is desired for magnetic sliders with near-contact flying height. At the same time, fabrication of added features should be compatible with the existing slider micromachining process which is highly specialized and cost sensitive. Aimed at meeting the two requirements, a novel sensor configuration is explored in the present study. The new sensor configuration consists of a piezoelectric zinc oxide (ZnO) thin-film sensor sandwiched in the magnetic slider on its trailing side. Coupled structural and piezoelectric finite-element analysis for a sensor-slider- suspension assembly was performed to investigate the dynamic sensing performance. Output voltages on the millivolt level were obtained under typical head-disk interactions. The 2nd in-plane bending mode of the slider was found to be the major contributor to the output voltage. Parametric study showed that a thicker ZnO layer generally generated a larger output, while the thickness of the slider overcoat only had minimal effect. Simulation results from harmonic and transient analyses demonstrated that the piezoelectric thin-film ZnO sensor is sufficiently sensitive for detection of head-disk contact.
URI: https://hdl.handle.net/10356/101400
http://hdl.handle.net/10220/18361
ISSN: 0946-7076
DOI: 10.1007/s00542-013-1839-3
Rights: © 2013 Springer-Verlag Berlin Heidelberg. This is the author created version of a work that has been peer reviewed and accepted for publication by Microsystem technologies, Springer-Verlag Berlin Heidelberg. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1007/s00542-013-1839-3].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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