Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/102341
Title: Static and fatigue failure analysis of adhesively bonded thick composite single lap joints
Authors: Tang, J. H.
Sridhar, I.
Srikanth, N.
Keywords: DRNTU::Engineering::Mechanical engineering::Alternative, renewable energy sources
Issue Date: 2013
Source: Tang, J. H., Sridhar, I., & Srikanth, N. (2013). Static and fatigue failure analysis of adhesively bonded thick composite single lap joints. Composites Science and Technology, 86, 18-25.
Series/Report no.: Composites science and technology
Abstract: Static and fatigue behavior of thick composite laminate single lap joints with thick adhesive bondline is experimentally and numerically investigated. Stress based analysis is used to understand the uniaxial tensile behavior of thick glass fiber reinforced epoxy laminates bonded with relatively thick epoxy adhesive. The effect of adhesive thickness on relatively thick adherend on the fatigue initiation life was modeled with generalized stress singularity approach. It was observed that the failure onset always occurred at adherend–adhesive interface. Subsequent crack propagation mostly resulted in interlaminar failure of adjacent first angle ply near to this interface. Both static and fatigue strength values decrease with increase of bondline thickness. Evaluation of generalized stress intensity factors of the corner geometry (square edge joint) provided a good correlation between predictions and experimental measurements.
URI: https://hdl.handle.net/10356/102341
http://hdl.handle.net/10220/18970
DOI: 10.1016/j.compscitech.2013.06.018
Rights: © 2013 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Composites Science and Technology, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [DOI: http://dx.doi.org/10.1016/j.compscitech.2013.06.018].
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:ERI@N Journal Articles
MAE Journal Articles

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