dc.contributor.authorLoeblein, Manuela
dc.contributor.authorTay, Roland Yingjie
dc.contributor.authorTsang, Siu Hon
dc.contributor.authorNg, Wei Beng
dc.contributor.authorTeo, Edwin Hang Tong
dc.date.accessioned2014-09-10T05:45:13Z
dc.date.available2014-09-10T05:45:13Z
dc.date.copyright2014en_US
dc.date.issued2014
dc.identifier.citationLoeblein, M., Tay, R. Y., Tsang, S. H., Ng, W. B., & Teo, E. H. T. (2014). Configurable Three-Dimensional Boron Nitride-Carbon Architecture and Its Tunable Electronic Behavior with Stable Thermal Performances. Small, 10(15), 2992-2999.en_US
dc.identifier.issn1613-6810en_US
dc.identifier.urihttp://hdl.handle.net/10220/20478
dc.description.abstractRecent developments of 3D-graphene and 3D-boron-nitride have become of great interest owing to their potential for ultra-light flexible electronics. Here we demonstrate the first synthesis of novel 3D-BNC hybrids. By specifically controlling the compositions of C and BN, new fascinating properties are observed, such as highly tunable electrical conductivity, controllable EMI shielding properties, and stable thermal conductivity. This ultra-light hybrid opens up many new applications such as for electronic packaging and thermal interface materials (TIMs).en_US
dc.language.isoenen_US
dc.relation.ispartofseriesSmallen_US
dc.rights© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.en_US
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
dc.titleConfigurable three-dimensional boron nitride-carbon architecture and its tunable electronic behavior with stable thermal performancesen_US
dc.typeJournal Article
dc.contributor.researchTemasek Laboratoriesen_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.identifier.doihttp://dx.doi.org/10.1002/smll.201400292


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