dc.contributor.authorNguyen, N T
dc.contributor.authorHuang, X Y
dc.contributor.authorToh, K C
dc.date.accessioned2014-10-07T02:08:46Z
dc.date.available2014-10-07T02:08:46Z
dc.date.copyright2001en_US
dc.date.issued2001
dc.identifier.citationNguyen, N. T., Huang, X. Y.,& Toh, K. C. (2001). Thermal flow sensor for ultra-low velocities based on printed circuit board technology. Measurement science and technology, 12(12), 2131-2136.en_US
dc.identifier.issn0957-0233en_US
dc.identifier.urihttp://hdl.handle.net/10220/23963
dc.description.abstractThis paper presents a new thermal flow sensor for ultra-low velocities. The sensor was fabricated with the standard printed circuit board (PCB) technology. The technology and the simple sensor design would reduce costs in fabrication and packaging. A one-dimensional analytical model is presented in order to understand the working principle and to optimize the sensitivity. A two-dimensional finite element analysis (FEA) model is also presented. The paper describes the experimental investigations of the temperature field around a heater under the influence of forced convection. The experimental and theoretical optimization results lead to the design of the PCB sensor whose characteristics are presented at the end of the paper. With the current calibration facility, the sensor is able to measure air flow velocities less than 80 mm s-1.en_US
dc.language.isoenen_US
dc.relation.ispartofseriesMeasurement science and technologyen_US
dc.rights© 2001 IOP Publishing Ltd.en_US
dc.subjectDRNTU::Engineering::Aeronautical engineering::Aerodynamics
dc.titleThermal flow sensor for ultra-low velocities based on printed circuit board technologyen_US
dc.typeJournal Article
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.identifier.doihttp://dx.doi.org/10.1088/0957-0233/12/12/314
dc.identifier.rims83166


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