Customized glass sealant for ceramic substrates for high temperature electronic application
Gan, Chee Lip
Date of Issue2014
School of Materials Science and Engineering
This study investigates the ceramic to ceramic bonding, using composite glass frit as the binding layer that is able to tolerate a high temperature environment for ruggedized microelectronic applications. Shear strength measurements were carried out at both room and high temperature (i.e. 250 °C) to evaluate room and high temperature performance of the joints. The glass joints in both the Al2O3/glass/Al2O3 and AlN/glass/AlN systems maintained their integrity even when shear-tested at 250 °C. The results of the mechanical and microstructural characterizations demonstrate that Bi-based two phase glass frit bonding is an effective ceramic bonding method for harsh-environment electronic packaging.
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
© 2014 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics reliability, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.microrel.2014.07.005].