Transient liquid phase Ag-based solder technology for high-temperature packaging applications
Date of Issue
2013School
School of Materials Science and Engineering
Version
Accepted version
Abstract
A lead-free Ag-based soldering technique through transient-liquid-phase (TLP) bonding is proposed in this study for high-temperature microelectronic packaging applications. The solder paste, which contained Ag and Sn powders with a no-clean flux, was used to join Cu substrates. The setup was bonded at 250 °C for 10 minutes. The study focuses on mechanical and microstructural characterizations of the joints. The shear strength measured at 250 °C shows good high temperature performance of the joint. The effects of Ag and Sn contents on mechanical, electrical and thermal properties of sintered bulk Ag–Sn samples were also investigated independently. The results demonstrate that the Ag–Sn TLP bonding is an effective interconnection method for harsh environment electronic packaging.
Subject
DRNTU::Engineering::Materials::Metallic materials::Alloys
Type
Journal Article
Series/Journal Title
Journal of alloys and compounds
Rights
© 2013 Elsevier B.V. This is the author created version of a work that has been peer reviewed and accepted for publication by Journal of alloys and compounds, Elsevier B.V. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.jallcom.2013.10.204].
Collections
http://dx.doi.org/10.1016/j.jallcom.2013.10.204
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