Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/81211
Title: Molecular adhesion controlled microelectromechanical memory device for harsh environment data storage
Authors: Chua, Geng Li
Singh, Pushpapraj
Soon, Bo Woon
Liang, Ying Shun
Jayaraman, Karthik Gopal
Singh, Navab
Kim, Tony Tae-Hyoung
Keywords: Microelectrochemical systems
Electrodes
Magnetic storage devices
Adhesion
Electrostatics
Issue Date: 2014
Source: Chua, G. L., Singh, P., Soon, B. W., Liang, Y. S., Jayaraman, K. G., Kim, T. T.-H., et al. (2014). Molecular adhesion controlled microelectromechanical memory device for harsh environment data storage. Applied Physics Letters, 105(11), 113503-.
Series/Report no.: Applied Physics Letters
Abstract: This work demonstrates a cantilever based electrostatic microelectromechanical system device operating as a memory element. Volatile and non-volatile functions are engineered by manipulating molecular adhesion force through contact dimples and restoring force using the cantilever design. For non-volatile RESET operation, a method of detaching the cantilever with 3 V pulsating DC signal at 1 MHz is proposed. SET/RESET cycles are performed up to 103 times at 300 °C without any performance degradation. A writing speed of up to 0.94 μs is achieved, which is faster than conventional high temperature flash memories. With demonstrated attributes, the fabricated device offers excellent potential for harsh environment data storage applications.
URI: https://hdl.handle.net/10356/81211
http://hdl.handle.net/10220/39210
ISSN: 0003-6951
DOI: 10.1063/1.4895578
Schools: School of Electrical and Electronic Engineering 
Rights: © 2014 American Institute of Physics (AIP). This paper was published in Applied Physics Letters and is made available as an electronic reprint (preprint) with permission of American Institute of Physics (AIP). The published version is available at: [http://dx.doi.org/10.1063/1.4895578]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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