dc.contributor.authorGhassemali, Ehsan
dc.contributor.authorTan, Ming-Jen
dc.contributor.authorWah, Chua Beng
dc.contributor.authorLim, S.C.V.
dc.contributor.authorJarfors, Anders E.W.
dc.identifier.citationGhassemali, E., Tan, M.-J., Wah, C. B., Lim, S., & Jarfors, A. E. (2015). Effect of cold-work on the Hall–Petch breakdown in copper based micro-components. Mechanics of Materials, 80124-135.en_US
dc.description.abstractEffects of substructural dimensions on the mechanical properties of micro-pins produced by an open-die micro-extrusion/forging process were studied. Micro-pins of diameter 0.3 mm were manufactured from copper strips, having different initial grain sizes. Micro-compression tests on the micro-pins revealed no significant size effect, even if the number of grains over the diameter of the micro-pins falls below its critical value. However, relaxation of the as-formed substructure using recovery annealing led to a surprising drop in the flow stress of the micro-pins. This was explained and attributed to the number of subgrains over the diameter of the micro-pins, showing the important role of subgrains rather than grains in determining the mechanical properties.en_US
dc.description.sponsorshipASTAR (Agency for Sci., Tech. and Research, S’pore)en_US
dc.format.extent32 p.en_US
dc.relation.ispartofseriesMechanics of Materialsen_US
dc.rights© 2014 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Mechanics of Materials, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.mechmat.2014.10.003].en_US
dc.subjectSize effect
dc.subjectDislocation cells
dc.titleEffect of cold-work on the Hall–Petch breakdown in copper based micro-componentsen_US
dc.typeJournal Article
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.versionAccepted versionen_US
dc.contributor.organizationA*STAR SIMTechen_US

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