Surface roughness effect on copper–alumina adhesion
Lim, Ju Dy
Yeow, Su Yi Susan
Rhee, MinWoo Daniel
Leong, Kam Chew
Wong, Chee Cheong
Date of Issue2013-10-12
School of Materials Science and Engineering
The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With rougher surface, the adhesive strength between a deposited copper film and the alumina substrate is higher due to the larger contact area at the interface. For 99.99% pure copper–96% pure alumina, this effect can account for an adhesive strength increment of more than 50%.
© 2013 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics Reliability, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.microrel.2013.07.016].