Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/81512
Title: In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper
Authors: Zhang, Bowei
Wu, Junsheng
Peng, Dongdong
Li, Xiaogang
Huang, Yizhong
Keywords: In-situ
SVET
Issue Date: 2016
Source: Zhang, B., Wu, J., Peng, D., Li, X., & Huang, Y. (2016). In-situ Scanning Micro-Electrochemical Characterization of Corrosion Inhibitors on Copper. International Journal of Electrochemical Science, 11, 4110-4119.
Series/Report no.: International Journal of Electrochemical Science
Abstract: In-situ scanning vibrating electrode technique (SVET) combined with other techniques (such as electrochemical impedance spectroscopy (EIS), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS)) was used to investigate the efficiency of the mixed compound of 3-amino-1, 2, 4-triazole (ATA) and sodium molybdate (SM) as a corrosion inhibitor for copper in 3.5% NaCl solution in comparison with benzotriazole (BTA). The results indicate that copper shows extremely higher corrosion resistance in 3.5% NaCl solution with the presence of ATA-SM inhibitor than BTA. This is due to the reaction of ATA with copper allowing the formation of a thin film incorporated with MoO4 ion precipitates on the surface of copper, which provides strong cathodic efficiency and thus is considerably protective.
URI: https://hdl.handle.net/10356/81512
http://hdl.handle.net/10220/40846
ISSN: 1452-3981
DOI: 10.20964/110367
Rights: © 2016 The Authors. Published by ESG (www.electrochemsci.org). This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution license (http://creativecommons.org/licenses/by/4.0/).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MSE Journal Articles

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