Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/85041
Title: An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing
Authors: Nguyen, N. Y.
Zhong, Zhao Wei
Tian, Yebing
Keywords: Chemical–mechanical polishing
Fixed abrasive
Issue Date: 2014
Source: Nguyen, N. Y., Zhong, Z. W., & Tian, Y. (2015). An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing. The International Journal of Advanced Manufacturing Technology, 77(5), 897-905.
Series/Report no.: The International Journal of Advanced Manufacturing Technology
Abstract: Fixed abrasive chemical–mechanical polishing (CMP) is an efficient surface finishing method. The non-uniformity of substrates after polishing is one of the most interesting things in current trends in research. One of the reasons for the non-uniformity is pad wear. The pad in this polishing process has abrasive grains embedded on the surface. Researching on the pad wear will help improve the pad conditioning process to get a better pad surface. Some studies have used kinematic motion to show the correlation between the cutting path density and the pad wear. However, the effect of contact time between the conditioner’s grains and the pad surface on the pad wear non-uniformity has not been integrated yet. In this research, an analytical model was established by combining of the kinematic motions and the contact time to investigate the pad wear non-uniformity. The results indicated that the cutting path density and the contact time near the pad center are more than that near the pad edge. They could be the main reasons of the non-uniformity of the pad wear. The model results showed a good agreement with experiments.
URI: https://hdl.handle.net/10356/85041
http://hdl.handle.net/10220/40933
ISSN: 0268-3768
DOI: 10.1007/s00170-014-6490-3
Rights: © 2014 Springer-Verlag London.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:MAE Journal Articles

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