dc.contributor.authorTian, Ye Bing
dc.contributor.authorZhong, Zhao Wei
dc.contributor.authorLai, S. T.
dc.contributor.authorAng, Y. J.
dc.identifier.citationTian, Y. B., Zhong, Z. W., Lai, S. T., & Ang, Y. J. (2013). Development of fixed abrasive chemical mechanical polishing process for glass disk substrates. The International Journal of Advanced Manufacturing Technology, 68(5), 993-1000.en_US
dc.description.abstractGlass disk substrates are used in a wide range of portable devices because of their relatively high resistance to heat and shocks compared to aluminum substrates. Chemical mechanical polishing (CMP) with fixed abrasive pad is an alternative glass disk substrates finishing method to loose abrasive lapping and polishing with traditional pad. In this paper, we developed a chemical mechanical polishing process for 2.5-inch glass disk substrates using a fixed abrasive pad. A serial of CMP experiments were carried out under different polishing variables and conditioning modes (ex situ and in situ conditioning). The polishing performances were evaluated and analyzed in terms of surface roughness, surface topography, and material removal rate. The polishing characteristics were also discussed to reveal material removal mechanism and surface generation involved in fixed abrasive CMP for glass disk substrates.en_US
dc.description.sponsorshipASTAR (Agency for Sci., Tech. and Research, S’pore)en_US
dc.relation.ispartofseriesThe International Journal of Advanced Manufacturing Technologyen_US
dc.rights© 2013 Springer-Verlag London.en_US
dc.subjectChemical mechanical polishingen_US
dc.subjectFixed abrasive polishingen_US
dc.titleDevelopment of fixed abrasive chemical mechanical polishing process for glass disk substratesen_US
dc.typeJournal Article
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.contributor.organizationA*STAR SIMTechen_US

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