dc.contributor.authorKeane, Phillip
dc.contributor.authorChua, Chee Kai
dc.contributor.authorJoshi, Sunil Chandrakant
dc.date.accessioned2016-12-13T09:12:48Z
dc.date.available2016-12-13T09:12:48Z
dc.date.issued2016
dc.identifier.citationKeane, P., Chua, C. K., & Joshi, S. C. (2016). Embedding Electronics In Printing ULTEM 9085 Quadcopter. Proceedings of the 2nd International Conference on Progress in Additive Manufacturing (Pro-AM 2016), 79-84.en_US
dc.identifier.urihttp://hdl.handle.net/10220/41849
dc.description.abstractThere are a lot of benefits, particularly in aerospace and automotive engineering applications, to embedding electronic systems within structural bodies. First and foremost is the benefit of weight reduction. Typically, electronic hardware must be fitted into some form of protective casing before being mounted onto a bracket, and then onto the airframe section (or into a car) where the hardware can potentially become exposed to variations in pressure, temperature and moisture. By using additive manufacturing to embed the electronics into structural elements, the need for protective casing and brackets can be alleviated, reducing weight and cost while adding protection from the elements. ULTEM 9085 is an engineering thermoplastic used widely in the aerospace industry due to its high tensile and specific strengths relative to other 3D printed thermoplastics (see Figures 1 and 2). Additionally, ULTEM 9085 has been certified for use in commercial aviation and spaceflight applications, due to its low toxicity and low outgassing properties.en_US
dc.description.sponsorshipNRF (Natl Research Foundation, S’pore)en_US
dc.format.extent6 p.en_US
dc.language.isoenen_US
dc.rights© 2016 by Pro-AM 2016 Organizers. Published by Research Publishing, Singaporeen_US
dc.subjectFDMen_US
dc.subjectULTEM 9085en_US
dc.titleEmbedding Electronics In Printing ULTEM 9085 Quadcopteren_US
dc.typeConference Paper
dc.contributor.conferenceProceedings of the 2nd International Conference on Progress in Additive Manufacturing (Pro-AM 2016)en_US
dc.contributor.researchSingapore Centre for 3D Printingen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.versionPublished versionen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record