dc.contributor.authorPing, Jianfeng
dc.contributor.authorGao, Feng
dc.contributor.authorChen, Jian Lin
dc.contributor.authorWebster, Richard David
dc.contributor.authorSteele, Terry W. J.
dc.date.accessioned2017-03-16T05:27:24Z
dc.date.available2017-03-16T05:27:24Z
dc.date.issued2015
dc.identifier.citationPing, J., Gao, F., Chen, J. L., Webster, R. D., & Steele, T. W. J. (2015). Adhesive curing through low-voltage activation. Nature Communications, 6, 8050-.en_US
dc.identifier.issn2041-1723en_US
dc.identifier.urihttp://hdl.handle.net/10220/42177
dc.description.abstractInstant curing adhesives typically fall within three categories, being activated by either light (photocuring), heat (thermocuring) or chemical means. These curing strategies limit applications to specific substrates and can only be activated under certain conditions. Here we present the development of an instant curing adhesive through low-voltage activation. The electrocuring adhesive is synthesized by grafting carbene precursors on polyamidoamine dendrimers and dissolving in aqueous solvents to form viscous gels. The electrocuring adhesives are activated at −2 V versus Ag/AgCl, allowing tunable crosslinking within the dendrimer matrix and on both electrode surfaces. As the applied voltage discontinued, crosslinking immediately terminated. Thus, crosslinking initiation and propagation are observed to be voltage and time dependent, enabling tuning of both material properties and adhesive strength. The electrocuring adhesive has immediate implications in manufacturing and development of implantable bioadhesives.en_US
dc.description.sponsorshipMOE (Min. of Education, S’pore)en_US
dc.format.extent9 p.en_US
dc.language.isoenen_US
dc.relation.ispartofseriesNature Communicationsen_US
dc.rights© 2015 Macmillan Publishers Ltd. This paper was published in Nature Communications and is made available as an electronic reprint (preprint) with permission of Macmillan Publishers Ltd. The published version is available at: [http://dx.doi.org/10.1038/ncomms9050]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.en_US
dc.subjectAdhesive agenten_US
dc.subjectDendrimeren_US
dc.titleAdhesive curing through low-voltage activationen_US
dc.typeJournal Article
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.contributor.schoolSchool of Physical and Mathematical Sciencesen_US
dc.identifier.doihttp://dx.doi.org/10.1038/ncomms9050
dc.description.versionPublished versionen_US


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