dc.contributor.authorLim, Hoong-Ta
dc.contributor.authorMurukeshan Vadakke Matham
dc.identifier.citationLim, H.-T., & Murukeshan Vadakke Matham. (2017). Note: Design considerations and characterization of a flexible snapshot hyperspectral probe. Review of Scientific Instruments, 88, 036107-.en_US
dc.description.abstractHyperspectral imaging is a combination of imaging and spectroscopy to give detailed spectral information for each spatial point in the imaged scene. Using the concept of integral field spectroscopy, a custom fabricated two-dimensional to one-dimensional fiber bundle has recently been reported. It is used as a flexible snapshot hyperspectral probe, which can be used as an endoscope for biomedical applications. This paper reports on the design considerations of the fiber bundle as the flexible probe in the snapshot hyperspectral imaging system. The physical characterization of the custom fabricated fiber bundle and lateral resolution of the developed hyperspectral imaging system are also analyzed and described.en_US
dc.description.sponsorshipMOE (Min. of Education, S’pore)en_US
dc.format.extent3 p.en_US
dc.relation.ispartofseriesReview of Scientific Instrumentsen_US
dc.rights© 2017 American Institute of Physics (AIP). This paper was published in Review of Scientific Instruments and is made available as an electronic reprint (preprint) with permission of American Institute of Physics (AIP). The published version is available at: [http://dx.doi.org/10.1063/1.4978804]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.en_US
dc.subjectEndoscopic imagingen_US
dc.subjectMedical image artifactsen_US
dc.titleNote: Design considerations and characterization of a flexible snapshot hyperspectral probeen_US
dc.typeJournal Article
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.versionPublished versionen_US

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