Spatial calibration and image processing requirements of an image fiber bundle based snapshot hyperspectral imaging probe: From raw data to datacube
Murukeshan Vadakke Matham
Date of Issue2017
Proceedings of SPIE - Fifth International Conference on Optical and Photonics Engineering
School of Mechanical and Aerospace Engineering
Centre for Optical and Laser Engineering
Hyperspectral imaging was first used in remote sensing and since then, it has been used in many other applications such as cancer diagnosis, precision farming and assessment of the level of flaking in ancient murals. In order to make hyperspectral imaging available for a wide variety of applications, its imagers can be made to operate using different methods and developed into different configurations. This leads to each variant having a set of specifications suitable for certain applications. The many variants of hyperspectral imager produce a set of three-dimensional spatial spatialspectral datacube, which is made up of hundreds of spectral images of one scene. A snapshot hyperspectral imaging probe has recently been developed by integrating a fiber bundle, which is made up of specially-arranged optical fibers, with a spectrograph-based hyperspectral imager. The snapshot method is able to produce a datacube using the information from each scan. The fiber bundle has 100 fiberlets which are arranged in a row in the one-dimensional proximal end, and are rearranged into a 10×10 hexagonal array in the two-dimensional distal end. The image captured by the two-dimensional end of the fiber bundle is reduced from two to one spatial dimension at the one-dimensional end. The raw data acquired from each scan has to be remapped into a datacube with the correct representation of the spectral and spatial features of the captured scene. This paper reports the spatial calibrations of both ends of the fiber bundle and image processing that have to be performed for such a remapping.
© 2017 Society of Photo-optical Instrumentation Engineers (SPIE). This paper was published in Proceedings of SPIE - Fifth International Conference on Optical and Photonics Engineering and is made available as an electronic reprint (preprint) with permission of Society of Photo-optical Instrumentation Engineers (SPIE). The published version is available at: [http://dx.doi.org/10.1117/12.2270739]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.