Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/86546
Title: Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects
Authors: Gan, Chee Lip
Tan, Chuan Seng
Dai, Y. Y.
Ng, M. Z.
Anantha, P.
Lin, Y. D.
Li, Z. G.
Keywords: Pastes
Nanoparticles
Issue Date: 2016
Source: Dai, Y. Y., Ng, M. Z., Anantha, P., Lin, Y. D., Li, Z. G., Gan, C. L., et al. (2016). Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects. Applied Physics Letters, 108(26), 263103-.
Series/Report no.: Applied Physics Letters
Abstract: An enhanced copper paste, formulated by copper micro- and nano-particles mixture, is reported to prevent paste cracking and obtain an improved packing density. The particle mixture of two different sizes enables reduction in porosity of the micro-paste and resolves the cracking issue in the nano-paste. In-situ temperature and resistance measurements indicate that the mixed paste has a lower densification temperature. Electrical study also shows a ∼12× lower sheet resistance of 0.27 Ω/sq. In addition, scanning electron microscope image analysis confirms a ∼50% lower porosity, which is consistent with the thermal and electrical results. The 3:1 (micro:nano, wt. %) mixed paste is found to have the strongest synergistic effect. This phenomenon is discussed further. Consequently, the mixed paste is a promising material for potential low temperature 3D interconnects fabrication.
URI: https://hdl.handle.net/10356/86546
http://hdl.handle.net/10220/44098
ISSN: 0003-6951
DOI: http://dx.doi.org/10.1063/1.4954966
Rights: © 2016 American Institute of Physics (AIP). This paper was published in Applied Physics Letters and is made available as an electronic reprint (preprint) with permission of American Institute of Physics (AIP). The published version is available at: [http://dx.doi.org/10.1063/1.4954966]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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