dc.contributor.authorDai, Y. Y.
dc.contributor.authorNg, M. Z.
dc.contributor.authorAnantha, P.
dc.contributor.authorLin, Y. D.
dc.contributor.authorLi, Z. G.
dc.contributor.authorGan, Chee Lip
dc.contributor.authorTan, Chuan Seng
dc.date.accessioned2017-12-06T06:07:49Z
dc.date.available2017-12-06T06:07:49Z
dc.date.issued2016
dc.identifier.citationDai, Y. Y., Ng, M. Z., Anantha, P., Lin, Y. D., Li, Z. G., Gan, C. L., et al. (2016). Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects. Applied Physics Letters, 108(26), 263103-.en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://hdl.handle.net/10220/44098
dc.description.abstractAn enhanced copper paste, formulated by copper micro- and nano-particles mixture, is reported to prevent paste cracking and obtain an improved packing density. The particle mixture of two different sizes enables reduction in porosity of the micro-paste and resolves the cracking issue in the nano-paste. In-situ temperature and resistance measurements indicate that the mixed paste has a lower densification temperature. Electrical study also shows a ∼12× lower sheet resistance of 0.27 Ω/sq. In addition, scanning electron microscope image analysis confirms a ∼50% lower porosity, which is consistent with the thermal and electrical results. The 3:1 (micro:nano, wt. %) mixed paste is found to have the strongest synergistic effect. This phenomenon is discussed further. Consequently, the mixed paste is a promising material for potential low temperature 3D interconnects fabrication.en_US
dc.format.extent5 p.en_US
dc.language.isoenen_US
dc.relation.ispartofseriesApplied Physics Lettersen_US
dc.rights© 2016 American Institute of Physics (AIP). This paper was published in Applied Physics Letters and is made available as an electronic reprint (preprint) with permission of American Institute of Physics (AIP). The published version is available at: [http://dx.doi.org/10.1063/1.4954966]. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper is prohibited and is subject to penalties under law.en_US
dc.subjectPastesen_US
dc.subjectNanoparticlesen_US
dc.titleEnhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnectsen_US
dc.typeJournal Article
dc.contributor.researchNTU-Lockheed Martin Joint Laben_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.identifier.doihttp://dx.doi.org/10.1063/1.4954966
dc.description.versionPublished versionen_US


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